XC7A35T-3CSG325E

The XC7A35T-3CSG325E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides reprogrammable digital logic resources packaged in a 324-CSPBGA (15×15) surface-mount package.

Key on-chip resources include 33,280 logic elements, approximately 1.843 Mbits of embedded RAM, and 150 user I/O pins. The device is offered in extended grade with an operating temperature range of 0 °C to 100 °C and a nominal supply voltage of 950 mV.

Key Features

• Programmable Logic Capacity — 33,280 logic elements provide the configurable logic fabric for custom digital functions and finite-state designs.
• Configurable Logic Blocks (CLBs) — 2,600 CLBs for implementing distributed logic and routing resources across the device.
• Embedded Memory — Approximately 1.843 Mbits of on-chip RAM for buffering, FIFOs, and small data storage.
• I/O Resources — 150 user I/O pins to interface with peripherals, sensors, and external logic devices.
• Package and Mounting — 324-CSPBGA (15×15) supplier device package in a tray format; designed for surface-mount assembly.
• Power — Specified supply voltage of 950 mV for core operation.
• Temperature and Grade — Extended grade device with an operating range of 0 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Custom digital logic — Implement application-specific state machines and data-paths using the 33,280 logic elements and 2,600 CLBs.
• Interface bridging — Use the 150 I/O pins to implement protocol translators, bus interfaces, and peripheral adapters.
• On-chip buffering — Leverage approximately 1.843 Mbits of embedded RAM for temporary data storage, FIFOs, and packet buffering.

Unique Advantages

• Significant logic density: 33,280 logic elements enable considerable on-chip customization without external ASICs.
• Ample configurable logic blocks: 2,600 CLBs provide flexible placement of logic and routing for complex designs.
• On-chip memory: Approximately 1.843 Mbits of embedded RAM reduces dependence on external memory for moderate buffering needs.
• Generous I/O count: 150 user I/O pins allow direct interfacing to a wide range of peripherals and sensors.
• Compact BGA package: 324-CSPBGA (15×15) offers a high-density, surface-mount footprint for space-constrained boards.
• Regulatory compliance: RoHS compliant for environmental and manufacturing alignment.

Why Choose XC7A35T-3CSG325E?

The XC7A35T-3CSG325E positions itself as a flexible FPGA option with a balance of logic resources, embedded memory, and I/O capacity in a compact CSPBGA package. Its extended grade and specified operating range make it suitable for designs that require a reprogrammable hardware element with moderate thermal and environmental requirements.

This device is appropriate for development teams and procurement focused on integrating programmable logic for custom control, interface, and buffering tasks while maintaining a compact board footprint and RoHS compliance.

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