XC7A35T-3FTG256E

The XC7A35T-3FTG256E is an Artix-7 field programmable gate array (FPGA) from AMD designed for mid-range programmable logic applications. It integrates approximately 33,280 logic elements, around 1.8432 Mbits of embedded memory, and 170 user I/O in a compact surface-mount 256-ball BGA package. This device targets designs that require balanced logic capacity, on-chip memory, and a substantial I/O count within a 0 °C to 100 °C operating window.

Key Features

• Logic Capacity — 33,280 logic elements with 2,600 logic blocks, providing the programmable resources needed for custom digital functions and control logic.
• Embedded Memory — Approximately 1.8432 Mbits of on-chip RAM for data buffering, state storage, and small scratchpad needs without external memory.
• I/O Count — 170 user I/O pins to support multiple parallel interfaces, sensor connections, and peripheral control lines.
• Power Supply — Core voltage range of 0.95 V to 1.05 V, enabling predictable power sequencing and integration into regulated supply rails.
• Package & Mounting — Surface-mount 256-LBGA package (supplier device package: 256-FTBGA, 17×17), suitable for compact PCB layouts.
• Temperature & Grade — Extended grade with an operating range of 0 °C to 100 °C, suitable for commercial and some extended-environment applications.
• Compliance — RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement real-time control logic and custom state machines using the device’s logic elements and on-chip RAM while leveraging 170 I/Os for sensor and actuator connectivity.
• Embedded Processing — Offload protocol handling, peripheral aggregation, or custom accelerators using available logic and memory resources for mid-range embedded systems.
• Instrumentation & Test Equipment — Configure flexible digital front-ends, data conditioning, and control interfaces where compact packaging and a moderate I/O count are required.
• Communications Gateways — Aggregate and route parallel signals or implement protocol converters using the device’s logic resources and multiple I/O lines.

Unique Advantages

• Balanced Logic and Memory: The combination of ~33,280 logic elements and approximately 1.8432 Mbits of embedded memory supports diverse digital functions without immediate need for external memory.
• High I/O Density: 170 user I/Os enable versatile interfacing with peripherals, sensors, and external buses, reducing the need for additional interface chips.
• Compact, Surface-Mount Package: The 256-LBGA (256-FTBGA, 17×17) package provides a small PCB footprint for space-constrained designs while maintaining a robust I/O count.
• Predictable Power Range: Core supply between 0.95 V and 1.05 V supports integration into regulated power architectures with clear voltage requirements.
• Extended Operating Range: Extended grade operation from 0 °C to 100 °C accommodates a range of commercial and extended-environment deployments.
• RoHS Compliant: Meets environmental manufacturing requirements for lead-free assembly processes.

Why Choose XC7A35T-3FTG256E?

The XC7A35T-3FTG256E positions itself as a mid-range Artix-7 FPGA option that balances logic density, embedded memory, and I/O capacity in a compact 256-ball BGA package. Its specifications make it well suited for designers who need substantial programmable logic and on-chip RAM with a high number of I/Os while maintaining a predictable core voltage and extended-grade thermal range.

This device is appropriate for development teams and procurement groups targeting scalable, reliable implementations of custom digital functions, interface aggregation, or embedded control tasks where the listed logic, memory, I/O, package, and environmental attributes align with project requirements.

Request a quote or submit an inquiry today to check current availability and pricing for the XC7A35T-3FTG256E.