M2GL025T-1VFG256I

IC FPGA 138 I/O 256FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 138 1130496 27696 256-LFBGA

Quantity 173 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O138Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs27696Number of Logic Elements/Cells27696
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1130496

Overview of M2GL025T-1VFG256I – IGLOO2 FPGA, 27,696 Logic Elements, 256‑LFBGA

The M2GL025T-1VFG256I is an IGLOO2 field programmable gate array (FPGA) IC designed for industrial applications. It provides a combination of substantial logic capacity, embedded RAM, and a moderate I/O count in a compact 256‑LFBGA package.

With an operating temperature range of −40°C to 100°C and a supply range of 1.14 V to 2.625 V, this device is suited for designs that require robust operating margins and flexible power configurations.

Key Features

  • Logic Capacity  27,696 logic elements (LEs) to implement complex digital logic and control functions.
  • Embedded Memory  Approximately 1.13 Mbits of on-chip RAM for buffering, state storage, and algorithmic data handling.
  • I/O Resources  138 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
  • Power Supply Range  Operates from 1.14 V to 2.625 V to accommodate a range of core and I/O voltage domains.
  • Package and Mounting  256‑LFBGA package (supplier device package: 256‑FPBGA, 14×14) with surface mount construction for compact board integration.
  • Industrial Temperature Rating  Rated for −40°C to 100°C operation to meet the thermal needs of industrial environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Use where industrial temperature operation and substantial logic resources are required for control, sequencing, or state-machine implementations.
  • Embedded Processing and Glue Logic  Implement custom peripheral interfaces, protocol bridging, or control logic using the available logic elements and on-chip RAM.
  • I/O‑Dense Systems  Integrate multiple sensors, actuators, or communication channels using the 138 user I/O pins in a compact package.

Unique Advantages

  • High Logic Density: 27,696 logic elements provide capacity for complex designs without immediate need for larger devices.
  • On‑Chip Memory: Approximately 1.13 Mbits of embedded RAM reduces external memory requirements for buffering and local data storage.
  • Flexible I/O Count: 138 I/O pins enable integration with a wide range of peripherals and board-level interfaces.
  • Industrial Thermal Range: −40°C to 100°C rating supports deployment in demanding temperature environments.
  • Compact BGA Package: 256‑LFBGA (256‑FPBGA, 14×14) provides a space-efficient footprint for dense system designs.
  • Wide Supply Range: 1.14 V to 2.625 V operation offers flexibility for different power-rail architectures.

Why Choose M2GL025T-1VFG256I?

The M2GL025T-1VFG256I IGLOO2 FPGA balances significant logic resources, embedded memory, and a practical I/O complement in a compact industrial-grade package. Its electrical and thermal specifications make it a practical choice for engineers building robust embedded and industrial systems that require onboard programmable logic.

This device is well suited to teams needing a scalable, board-friendly FPGA option that combines on-chip RAM and ample logic elements while meeting RoHS requirements for modern manufacturing processes.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the M2GL025T-1VFG256I.

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