M2GL025T-FCS325I

The M2GL025T-FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for industrial embedded applications. It provides a configurable FPGA fabric with 27,696 logic elements, approximately 1.13 Mbits of embedded memory, and 180 user I/O pins to address a range of mid-density logic and interfacing requirements.

With a broad supply voltage window and an industrial operating temperature range, this surface-mount 325-TFBGA / FCBGA device is intended for designs that require flexible I/O, on-chip memory, and reliable operation across extended temperature conditions.

Key Features

• Core Logic  27,696 logic elements (cells) to implement combinational and sequential logic functions for mid-density FPGA designs.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM for buffers, FIFOs, and state storage.
• I/O Capacity  180 user I/O pins to support multiple external interfaces and peripherals.
• Power and I/O Voltage  Supports a supply voltage range of 1.14 V to 2.625 V, enabling flexible interfacing with a variety of power domains and I/O standards.
• Package and Mounting  325-TFBGA / FCBGA package in a 325-FCBGA (11×11) footprint designed for surface-mount assembly.
• Operating Temperature  Rated for -40 °C to 100 °C to meet industrial temperature requirements.
• Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Control & Automation  Implement custom logic, protocol bridging, and motor-control interfaces that require reliable operation across industrial temperature ranges.
• Embedded Systems  Provide programmable glue logic, peripheral interfacing, and on-chip buffering where moderate logic density and embedded RAM are required.
• Communications & Interface Bridging  Handle custom protocol adaptation and multi-I/O interfacing using the device’s 180 I/O pins and on-chip memory.

Unique Advantages

• Significant Logic Capacity: 27,696 logic elements allow implementation of complex state machines and moderate-density logic architectures without external glue logic.
• On-Chip Memory: Approximately 1.13 Mbits of embedded RAM reduces external memory needs for buffering and temporary storage.
• Flexible I/O Count: 180 user I/Os provide broad connectivity options for multiple interfaces and peripherals.
• Wide Supply Voltage Range: Operates from 1.14 V to 2.625 V to accommodate different power architectures and I/O level requirements.
• Industrial Temperature Rating: Specified -40 °C to 100 °C operation for dependable performance in demanding environments.
• Compact Surface-Mount Package: 325-FCBGA (11×11) package supports compact board layouts and automated assembly.

Why Choose M2GL025T-FCS325I?

The M2GL025T-FCS325I delivers a balanced combination of logic density, embedded memory, and I/O resources in an industrial-grade FPGA package. Its supply voltage flexibility and extended temperature rating make it suitable for designs that must operate reliably across varied power domains and environmental conditions.

This device is well-suited for engineers building industrial control, embedded, or communications interface solutions that require a programmable hardware platform with on-chip memory and substantial I/O capacity. Its surface-mount 325-FCBGA package supports compact, automated PCB assembly and integration into production systems.

If you would like pricing, availability, or a custom quote for M2GL025T-FCS325I, submit a request for a quote or contact sales to discuss your project requirements and procurement options.