M2GL025T-FCSG325

The M2GL025T-FCSG325 is an IGLOO2 field programmable gate array (FPGA) device from Microchip Technology configured in a 325-ball TFBGA/FCBGA package. It provides 27,696 logic elements with approximately 1.13 Mbits of embedded memory and up to 180 user I/O in a compact surface-mount package.

Designed for commercial-grade embedded designs, this device supports a wide voltage supply range and operates across a 0 °C to 85 °C temperature window, making it suitable for a variety of standard commercial applications that require flexible programmable logic and on-chip memory.

Key Features

• Logic Capacity 27,696 logic elements provide substantial programmable fabric for combinational and sequential logic implementation.
• Embedded Memory Approximately 1.13 Mbits of on-chip RAM to support buffering, FIFOs, and state storage without external memory.
• I/O Count Up to 180 user I/O pins suitable for interfacing with peripherals, sensors, and external logic.
• Power and Voltage Supports a broad supply voltage range from 1.14 V to 2.625 V to accommodate various core and I/O voltage schemes.
• Package and Mounting 325-TFBGA / 325-FCBGA (11×11) surface-mount package for high-density board integration and compact system footprints.
• Operating Range and Grade Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
• Manufacturer Produced by Microchip Technology and offered in a standard supplier device package: 325-FCBGA (11×11).

Typical Applications

• Commercial Embedded Systems — Implement control logic, peripherals bridging, and custom data paths within commercial products operating in the 0 °C to 85 °C range.
• High-Density Interface — Use the 180 I/O pins for multi-channel sensor interfaces, board-level protocol conversion, and I/O expansion tasks.
• On-Chip Memory-Dependent Logic — Leverage approximately 1.13 Mbits of embedded RAM for buffering, packet processing, and temporary data storage without external memory.

Unique Advantages

• Balanced Logic and Memory: Combines 27,696 logic elements with ~1.13 Mbits of on-chip RAM to implement sizable logic functions with internal data storage.
• Flexible I/O Count: 180 user I/Os enable direct interfacing to multiple peripherals and parallel data paths, reducing the need for external glue logic.
• Compact, Board-Friendly Package: 325-ball TFBGA/FCBGA (11×11) packaging supports high-density designs while remaining surface-mount compatible.
• Wide Supply Range: A 1.14 V to 2.625 V supply range accommodates different core and I/O voltage architectures in commercial systems.
• Commercial Grade and RoHS Compliant: Specified for 0 °C to 85 °C operation and meets RoHS directives for environmental compliance.

Why Choose M2GL025T-FCSG325?

The M2GL025T-FCSG325 offers a practical balance of logic density, embedded memory, and I/O capacity in a compact 325-ball BGA package from Microchip Technology. Its configuration is well suited for commercial embedded designs that require integrated programmable logic, significant on-chip RAM, and flexible interfacing options.

For design teams targeting scalable FPGA-based solutions in commercial environments, this IGLOO2 device delivers a clear combination of capacity and package density, enabling consolidation of discrete functions into a single programmable device while maintaining industry-standard packaging and RoHS compliance.

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