M2GL050-1FCS325

IC FPGA 200 I/O 325BGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA

Quantity 793 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case325-TFBGA, FCBGANumber of I/O200Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050-1FCS325 – IGLOO2 FPGA, 325-TFBGA, 200 I/O

The M2GL050-1FCS325 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology. It provides 56,340 logic elements and approximately 1.87 Mbits of embedded memory, delivered in a 325-TFBGA/FCBGA package with 200 I/O pins. This commercial-grade device supports a supply voltage range of 1.14 V to 2.625 V and operates from 0 °C to 85 °C.

Key Features

  • Core Logic 56,340 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM to store intermediate data, buffers, and state machines.
  • I/O Up to 200 user I/O pins to interface with peripherals, sensors, and external devices.
  • Power Operates across a supply voltage range of 1.14 V to 2.625 V to accommodate a variety of system power rails.
  • Package & Mounting Available in a 325-TFBGA / 325-FCBGA package; supplier device package listed as 325-FCBGA (11×11). Surface-mount mounting type.
  • Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS-compliant design for regulatory compliance in standard commercial applications.

Unique Advantages

  • Substantial logic capacity: 56,340 logic elements enable implementation of complex digital functions on a single device, reducing external logic requirements.
  • On-chip memory availability: Approximately 1.87 Mbits of embedded RAM supports data buffering and state storage without immediate need for external memory.
  • Generous I/O count: 200 I/O pins provide flexible connectivity options for multi-signal interfaces and peripheral expansion.
  • Flexible supply range: Support for 1.14 V to 2.625 V supply rails enables integration into diverse power architectures.
  • Compact BGA footprint: 325-ball TFBGA/FCBGA package with an 11×11 supplier package option helps save board area while supporting surface-mount assembly.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation to match many standard commercial electronics deployments.

Why Choose M2GL050-1FCS325?

The M2GL050-1FCS325 combines a substantial number of logic elements, on-chip memory, and a high I/O count in a compact 325-ball BGA package, addressing designs that require significant programmable logic and connectivity within a commercial-temperature envelope. With a flexible supply voltage range and RoHS compliance, it fits applications where integration, board space, and regulatory considerations matter.

Designed and manufactured by Microchip Technology, this IGLOO2 FPGA is a practical choice for teams seeking a commercially rated programmable logic device with clear, verifiable specifications for logic capacity, memory, I/O, power, and packaging.

Request a quote to check pricing and availability for the M2GL050-1FCS325 and to discuss how its specifications align with your project requirements.

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