M2GL050-1FCS325I

The M2GL050-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides reconfigurable digital logic resources in a compact 325-TFBGA / 325-FCBGA (11×11) surface-mount package.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 200 I/O, this industrial-grade FPGA is suited for embedded and industrial applications that require substantial on-chip logic, flexible interfacing, and operation across a wide temperature range.

Key Features

• FPGA Fabric  Field Programmable Gate Array architecture providing 56,340 logic elements for custom digital designs and parallel hardware functions.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM for buffering, state storage, and local data processing without the immediate need for external memory.
• I/O Capacity  200 I/O pins for direct connection to sensors, peripherals, and external logic interfaces.
• Power Supply Range  Operates from 1.14 V to 2.625 V to accommodate a range of system and IO voltage requirements.
• Package & Mounting  325-TFBGA / 325-FCBGA (11×11) supplier device package in a surface-mount form factor for compact PCB integration.
• Industrial Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

• Industrial Control  Use the device's logic density and industrial temperature rating for motor control, I/O expansion, and automation logic in factory or process control systems.
• Embedded Systems & Edge Processing  200 I/O and on-chip memory enable sensor aggregation, protocol bridging, and custom peripheral logic in compact embedded platforms.
• Communications & Networking  Reconfigurable logic and ample I/O support protocol processing, interface adaptation, and intermediate packet handling tasks.
• Instrumentation & Test Equipment  On-chip RAM and dense logic resources support real-time signal processing, data buffering, and measurement control functions.

Unique Advantages

• High Logic Density: 56,340 logic elements provide capacity for complex state machines, custom accelerators, and multi-function designs.
• Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and PCB layout.
• Flexible Interfacing: 200 I/O pins offer direct connectivity to a wide range of peripherals and external devices, minimizing bridge components.
• Industrial Reliability: Industrial grade and −40 °C to 100 °C operating range support deployment in temperature-demanding environments.
• Wide Supply Compatibility: 1.14 V to 2.625 V supply range enables integration with different system voltage domains and IO standards.
• Compact BGA Package: 325-TFBGA / 325-FCBGA (11×11) package balances pin count and PCB area for space-constrained designs.

Why Choose M2GL050-1FCS325I?

The M2GL050-1FCS325I positions itself as a mid-density, industrial-grade FPGA option that combines substantial logic capacity, on-chip memory, and a high I/O count in a compact BGA package. It is well suited for engineers building embedded, industrial, and communications systems who need reconfigurable hardware resources with predictable thermal and voltage tolerances.

Backed by Microchip Technology, this IGLOO2 FPGA offers a balance of integration and deployment reliability for designs that require scalable logic, local buffering, and broad interfacing options while meeting RoHS environmental requirements.

Request a quote or submit a procurement inquiry to check pricing, availability, and lead time for the M2GL050-1FCS325I.