M2GL050-1FCSG325I

The M2GL050-1FCSG325I is an IGLOO2 series Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 325-TFBGA (325-FCBGA 11×11) surface-mount package. It provides 56,340 logic elements, approximately 1.87 Mbits of embedded RAM, and 200 I/O pins in an industrial-grade package.

With a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require substantial on-chip logic and memory capacity while meeting industrial environmental requirements.

Key Features

• Core Logic 56,340 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• I/O Resources 200 I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
• Power and Voltage Support Wide supply range from 1.14 V to 2.625 V to accommodate multiple core and I/O voltage domains.
• Package and Mounting 325-TFBGA (supplier device package: 325-FCBGA, 11×11) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range Rated for −40 °C to 100 °C and specified as industrial grade for deployments within those temperature limits.
• Standards Compliance RoHS-compliant construction.

Unique Advantages

• High logic capacity: 56,340 logic elements provide the resources needed for substantial custom logic integration without immediate reliance on external PLDs.
• On-chip memory: Approximately 1.87 Mbits of embedded RAM reduces the need for external memory for many buffering and small data-storage tasks.
• Broad I/O availability: 200 I/Os enable flexible interfacing to sensors, controllers, and high-pin-count peripherals.
• Flexible power domains: Support for 1.14 V to 2.625 V supply voltages allows integration across varied power-rail architectures.
• Industrial robustness: Industrial-grade rating with −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact surface-mount package: 325-TFBGA (11×11) package conserves board area while providing high pin density.

Why Choose M2GL050-1FCSG325I?

The M2GL050-1FCSG325I delivers a balanced combination of logic density, embedded memory, and extensive I/O in an industrial-grade FPGA package from Microchip Technology. Its voltage flexibility and temperature rating make it suitable for designs that must operate across varied power conditions and environmental profiles.

This device is well suited for engineers and procurement teams seeking a field-programmable solution that consolidates logic and memory on-chip, reduces external component count, and fits a compact surface-mount 325-TFBGA footprint for industrial applications.

Request a quote or submit a pricing inquiry to discuss availability, lead times, and volume options for the M2GL050-1FCSG325I.