M2GL050-1FG896

IC FPGA 377 I/O 896FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

Quantity 216 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O377Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050-1FG896 – IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

The M2GL050-1FG896 is an IGLOO2 flash-based FPGA optimized for low-power, secure and high-performance programmable logic applications. Built on the IGLOO2 architecture, it combines a substantial logic fabric with multi-standard I/Os and integrated memory to address communication, signal processing and embedded control use cases.

With 56,340 logic elements, 377 user I/Os, and an 896-ball FBGA (31 × 31) package, this commercial-grade device targets designs that require dense logic, flexible I/O, and a broad supply voltage range for diverse board-level integrations.

Key Features

  • Logic Capacity — 56,340 logic elements provide a large programmable fabric suitable for complex glue-logic, protocol handling, and moderate DSP tasks.
  • Embedded Memory — Approximately 1.87 Mbits of on-chip RAM (1,869,824 total RAM bits) for LUTs, FIFOs and buffering requirements; the IGLOO2 family also offers embedded SRAM and nonvolatile memory options at the subsystem level.
  • High I/O Count — 377 user I/Os support multi-standard signaling and flexible board-level interfacing in a single device.
  • Package and Mounting — 896-FBGA (31 × 31) surface-mount package suitable for compact, high-density PCB layouts.
  • Supply Voltage Range — Operates across 1.14 V to 2.625 V to accommodate a variety of core and I/O domain configurations.
  • Operating Temperature — Commercial-grade specification from 0 °C to 85 °C for general embedded and consumer applications.
  • Family-Level High-Speed Interfaces — IGLOO2 family features include support for up to 16 SERDES lanes, PCIe endpoint cores (x1/x2/x4), and high-speed memory controllers (up to 2 DDRx controllers) for designs requiring serial links and external DDR memory interfaces.
  • DSP and Math — IGLOO2 architecture provides dedicated mathblocks for DSP operations (family-level capability up to 240 fast mathblocks), enabling efficient multiply-accumulate and signal-processing implementations.
  • Clocking and PLLs — Family clock resources include multiple oscillators and up to eight clock conditioning circuits with integrated PLLs for flexible clock generation and distribution.
  • Security and Reliability — IGLOO2 family security features include encrypted bitstream loading, supply-chain assurance device certificates, anti-tamper protections and zeroization options to help protect IP and sensitive designs.
  • Compliance — RoHS compliant for environmentally conscious manufacturing and assembly.

Typical Applications

  • High-speed Communications — Implement protocol bridging, serialization/deserialization and PHY interfacing using the IGLOO2 family’s SERDES and PCIe capabilities.
  • Memory Interface and Buffering — Use the on-chip RAM alongside DDRx controller support to build memory controllers, data buffering and packet reordering functions.
  • DSP and Signal Processing — Leverage embedded mathblocks and ample logic elements for filtering, FFTs, and real-time signal conditioning tasks.
  • Secure Embedded Systems — Deploy encrypted bitstreams and hardware security features to protect IP and enable secure boot or secure configuration workflows.

Unique Advantages

  • High Logic Density: 56,340 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Broad I/O Flexibility: 377 user I/Os enable mixed-signal and mixed-standard interfacing without external translators, simplifying system routing.
  • Integrated Memory Resources: Nearly 1.87 Mbits of on-chip RAM combined with family-level eSRAM/eNVM options provide versatile storage for buffers, state machines and configuration data.
  • Scalable Performance Options: Family support for SERDES lanes, PCIe and DDRx controllers lets designers scale bandwidth and external memory performance as system needs evolve.
  • Security-Ready: Built-in device and bitstream protection features support supply-chain assurance and encrypted configuration for IP-sensitive designs.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation across typical embedded and consumer operating environments.

Why Choose M2GL050-1FG896?

The M2GL050-1FG896 combines a substantial logic fabric with a high I/O count and integrated memory to deliver a flexible platform for communications, embedded control and signal-processing applications. Its IGLOO2 architecture brings family-level features—such as low-power flash-based configuration, security options and high-speed interface support—that align with designs requiring a balance of performance, integration and on-board security.

This device is well suited to engineers and procurement teams looking for a commercially graded FPGA in an 896-FBGA package that supports a wide voltage range and robust on-chip resources, enabling compact, reliable system designs with scalable peripheral and memory interfaces.

Request a quote or submit a pricing and availability inquiry to receive lead-time and procurement details for the M2GL050-1FG896.

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