M2GL050T-1FCS325

The M2GL050T-1FCS325 is an IGLOO2 field-programmable gate array (FPGA) IC from Microchip Technology, delivered in a 325-FCBGA package. It provides a commercial-grade, programmable logic platform suitable for designs requiring mid-range logic capacity, embedded memory and a substantial I/O count.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 200 I/O, this device is positioned for commercial embedded applications that need a balance of logic density, memory and flexible interfacing within a compact surface-mount BGA footprint. The device operates over a supply range of 1.14 V to 2.625 V and an ambient temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Logic Capacity  Provides 56,340 logic elements to implement medium-complexity programmable logic and control functions.
• On‑chip Memory  Includes approximately 1.87 Mbits of embedded memory for buffering, state storage and data processing functions.
• I/O Resources  Features 200 I/O pins to support multiple interfaces, sensor connections and board-level peripherals.
• Power Range  Operates from 1.14 V to 2.625 V to accommodate a range of system supply architectures.
• Package and Mounting  Supplied in a 325‑TFBGA / 325‑FCBGA package (supplier device package: 325‑FCBGA, 11×11) for surface-mount assembly.
• Operating Conditions  Commercial-grade operation with a specified ambient temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

• Commercial embedded systems  Programmable logic for control and processing in commercial electronics where mid-range logic and on-chip memory are required.
• I/O‑intensive interface hubs  Board-level designs that need many external connections can leverage the device's 200 I/O pins for peripheral and sensor interfacing.
• Buffered data handling  Use the on-chip memory to implement buffering, packet processing or temporary data storage in embedded designs.
• Compact BGA designs  The 325‑FCBGA (11×11) package supports compact, surface-mount PCB layouts where area and integration matter.

Unique Advantages

• Substantial logic resources: 56,340 logic elements enable implementation of complex finite-state machines, glue logic and custom processing blocks without external PLDs.
• Significant embedded memory: Approximately 1.87 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and scratchpad needs.
• High I/O count: 200 I/O pins provide flexibility for multiple interfaces, sensor arrays and mixed-signal front-ends.
• Flexible supply range: Support for 1.14 V to 2.625 V supplies allows integration into a variety of power architectures.
• Compact surface-mount package: The 325‑FCBGA (11×11) package offers a compact form factor suited to space-constrained PCBs.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial production environments.

Why Choose M2GL050T-1FCS325?

The M2GL050T-1FCS325 delivers a balanced combination of logic density, embedded memory and I/O capacity in a compact 325‑FCBGA package, making it well suited for commercial embedded designs that require programmable logic and on-chip storage without a large PCB footprint. Its supply voltage range and commercial operating temperature make it compatible with common system designs and manufacturing flows.

Designed for engineers and procurement teams seeking a mid-range IGLOO2 FPGA from Microchip Technology, this device provides verifiable on-chip resources and package options that support a wide variety of commercial applications while meeting RoHS requirements.

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