M2GL050T-1FG484

The M2GL050T-1FG484 is a flash-based IGLOO2 Field Programmable Gate Array (FPGA) integrating fourth-generation flash FPGA fabric with high-performance communications and memory interfaces. It is designed for applications requiring a balance of logic capacity, embedded memory, and multi-standard I/O flexibility.

Targeted use cases include high-speed communications, embedded processing with DSP acceleration, and systems requiring configurable DDR memory interfaces and multi‑lane serial links. The device combines on-chip logic and memory resources with a compact 484‑ball BGA package for surface-mount assembly.

Key Features

• Logic Capacity — Approximately 56,340 logic elements to implement a wide range of digital functions and soft IP.
• Embedded Memory — Approximately 1.87 Mbits of total on-chip RAM to support buffering, packet processing, and local storage.
• I/O and Voltage Range — 267 user I/Os with multi-standard support; supported supply voltage range from 1.14 V to 2.625 V.
• High‑Performance DSP — Family-level support for up to 240 mathblocks with hardware multiplication and accumulation for signal processing tasks.
• High-Speed Serial Interfaces — Series-level support for up to 16 SERDES lanes, including native SERDES, XAUI/XGXS (10 Gbps Ethernet PHY interfaces), and PCI Express endpoint capability.
• High-Speed Memory Controllers — Family DDRx controllers supporting LPDDR/DDR2/DDR3 memory standards with up to 333 MHz clock rate and configurable bus widths.
• On‑Chip System Resources — Family-level embedded nonvolatile memory and eSRAM (up to 512 KB eNVM and 64 KB eSRAM in the IGLOO2 family), DMA controllers and AHB/AXI interconnects for system integration.
• Clocking — Multiple integrated clock sources and up to eight Clock Conditioning Circuits (CCCs) with PLLs for flexible clock generation and distribution.
• Package & Mounting — Surface-mount 484‑FPBGA package (23 × 23 mm) for compact board integration.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• High‑Speed Communications — Implement multi‑lane SERDES links, PCIe endpoints or 10 Gbps PHY interfaces for networking and telecom equipment.
• Memory‑Intensive Embedded Systems — Use the integrated DDR controllers and on‑chip RAM for buffering and high‑throughput data paths in storage or streaming applications.
• DSP and Signal Processing — Deploy the device’s mathblocks and logic elements for real‑time signal processing, filtering, and aggregation tasks.
• Custom Control and Interface — Leverage flexible multi‑standard I/Os and internal DMA/AXI interconnects for protocol bridging, sensor aggregation, and system control functions.

Unique Advantages

• Integrated Flash‑Based Fabric: Flash configuration reduces external configuration dependencies and supports in-field reprogramming workflows.
• Balanced Logic and Memory: 56,340 logic elements paired with approximately 1.87 Mbits of on‑chip RAM enable mid‑range complex designs without immediate reliance on external memory.
• High‑Speed Connectivity: Native SERDES lanes and family support for PCIe and 10 Gbps interfaces simplify implementation of modern high‑bandwidth links.
• Flexible I/O and Voltage Support: 267 I/Os and a wide supply voltage window provide interface flexibility for mixed-voltage systems.
• Compact, Surface‑Mount Package: 484‑FPBGA (23 × 23 mm) offers a compact footprint for space-constrained boards while supporting high I/O counts.
• Compliance and Commercial Rating: RoHS compliant and rated for commercial temperature ranges (0 °C to 85 °C), suitable for mainstream embedded products.

Why Choose M2GL050T-1FG484?

The M2GL050T-1FG484 delivers a practical combination of logic density, embedded memory, and high‑speed interface capability in a single flash‑based FPGA package. It is well suited for designers building communications, embedded processing, and DSP‑centric systems that require configurable logic, integrated memory resources, and multi‑standard I/O support.

Choosing this IGLOO2 device provides a path to scalable designs that leverage family-level features such as SERDES lanes, DDRx memory controllers, and hardware DSP blocks, while maintaining a compact board footprint and RoHS compliance.

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