M2GL050T-1FG484M
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56340 484-BGA |
|---|---|
| Quantity | 1,543 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 1869824 |
Overview of M2GL050T-1FG484M – IGLOO2 FPGA, Military-Grade, 484‑BGA
The M2GL050T-1FG484M is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for military-grade, harsh-environment applications. It provides a balance of logic density, on-chip memory and I/O capacity in a compact 484‑ball BGA package.
With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 267 I/O pins, this device is targeted at embedded systems needing programmable logic, broad interfacing capability and qualification to MIL‑STD‑883.
Key Features
- Core Logic
56,340 logic elements to implement complex logic, control and data-path functions. - Embedded Memory
Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines and local data storage. - I/O Capacity
267 general-purpose I/O pins to interface with sensors, transceivers, peripherals and external logic. - Power
Wide supply voltage range from 1.14 V to 2.625 V to accommodate different core and I/O voltage requirements. - Package & Mounting
484‑ball FPBGA (23 × 23) package, surface-mount mounting type for compact PCB integration. - Qualification & Grade
Military grade with MIL‑STD‑883 qualification for reliability in demanding environments. - Operating Temperature
Rated for −55 °C to 125 °C operation to support extended-temperature deployments. - Environmental Compliance
RoHS compliant.
Typical Applications
- Military and Defense Systems
Implement mission logic, protocol bridging and data handling in systems requiring MIL‑STD‑883 qualification and extended temperature ranges. - Aerospace Electronics
Use the device for avionics control, sensor interfacing and custom processing where rugged, qualified components are required. - Rugged Embedded Controllers
Deploy as the programmable logic element in harsh-environment controllers that need high logic density and broad I/O. - Data Acquisition and Signal Processing
Leverage on-chip memory and large I/O counts for buffering, preprocessing and routing of sensor and telemetry data.
Unique Advantages
- High Logic Integration: 56,340 logic elements provide substantial programmable capacity for complex custom logic and control functions, reducing the need for external ASICs or discrete logic.
- Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM supports local buffering and state retention, simplifying system memory architecture.
- Extensive I/O Resources: 267 I/O pins enable wide peripheral and sensor connectivity without additional multiplexing hardware.
- Military Qualification: MIL‑STD‑883 qualification and a military grade designation support deployments in regulated and harsh operating environments.
- Wide Operating Range: Supply voltage of 1.14 V to 2.625 V and −55 °C to 125 °C temperature rating support flexible power architectures and extreme-temperature applications.
- Compact Surface-Mount Package: 484‑ball FPBGA (23 × 23) package provides a small footprint for board-level space savings while retaining high pin count.
Why Choose M2GL050T-1FG484M?
The M2GL050T-1FG484M delivers a combination of high logic density, ample embedded memory and a large I/O complement within a military‑qualified FPGA package. Its extended temperature range and MIL‑STD‑883 qualification make it a practical choice for designs that must operate reliably in demanding environments.
This device is well suited for engineers and procurement teams specifying programmable solutions for defense, aerospace and other rugged embedded systems where integration, reliability and environmental tolerance are primary concerns.
Request a quote or submit a pricing inquiry to discuss availability, lead times and ordering for the M2GL050T-1FG484M.

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