M2GL050T-1FGG484I

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56340 484-BGA

Quantity 595 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050T-1FGG484I – IGLOO2 Flash-based FPGA, 484-BGA

The M2GL050T-1FGG484I is an IGLOO2 family flash-based Field Programmable Gate Array (FPGA) offered in a 484-BGA (23×23) surface-mount package. Designed for industrial applications, it combines programmable logic, embedded memory and high-performance communications interfaces to support data-path processing, memory interfacing and secure system functions.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 267 user I/Os, this device targets designs that require a balance of integration, I/O density and configurable high-speed interfaces while operating across a wide supply and temperature range.

Key Features

  • Core Logic Efficient 4-input LUT architecture with carry chains; the device provides 56,340 logic elements for implementing complex digital logic and control functions.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM along with family-level embedded memory structures (including eSRAM and eNVM options) to support buffering, state storage and code/data retention.
  • DSP & Mathblocks IGLOO2 family mathblocks and DSP resources for multiply-accumulate and signal processing tasks (family documentation lists fast mathblocks and wide accumulators).
  • High-Speed Serial Interfaces Family support for high-speed SERDES lanes (up to 16 lanes) and protocol extensions including PCI Express, XAUI/XGMII and native SERDES for serial communications.
  • Memory Controllers Family-level support for up to two high-speed DDRx memory controllers (LPDDR/DDR2/DDR3) and associated data reordering and command optimization features.
  • Clocking Multiple clock sources and up to eight Clock Conditioning Circuits (CCCs) with integrated PLLs, supporting input frequencies from 1 to 200 MHz and output up to 400 MHz (family capabilities).
  • I/O and Voltage Range 267 user I/Os with multi-standard support; device supply range from 1.14 V to 2.625 V to accommodate varied I/O and core voltage schemes.
  • Security Features Family-level design and data security features including encrypted key/bitstream loading, device certificate and cryptographic services (AES-256, SHA-256, ECC) on premium devices.
  • Package & Environmental 484-BGA (23×23) surface-mount package, industrial grade, RoHS compliant, and rated for operation from -40 °C to 100 °C.

Typical Applications

  • High-Speed Networking Implement Ethernet PHY interfaces, XAUI/XGMII links or serial communication endpoints using the device’s high-speed SERDES and protocol support.
  • Memory Interface and Bridging Use the integrated DDRx controllers and on-chip memory to build high-throughput memory interfaces, buffering and command/data reordering functions.
  • Signal Processing Leverage mathblocks and embedded RAM for DSP tasks such as filtering, accumulation and real-time data processing in industrial applications.
  • Secure Embedded Systems Apply built-in security primitives and encrypted bitstream capability to protect intellectual property and enable secure boot or secure configuration workflows.

Unique Advantages

  • High Logic Density: 56,340 logic elements provide room for complex control, data-path and interface logic within a single device, reducing board-level component count.
  • Integrated Memory Resources: Approximately 1.87 Mbits of embedded RAM plus family-level eSRAM/eNVM options simplify buffer and state-storage requirements without large external memories.
  • Flexible I/O and Voltage Support: 267 user I/Os and a wide supply range (1.14 V–2.625 V) enable mixed-signal interfacing and adaptable system power architectures.
  • High-Speed Connectivity: Support for SERDES lanes and PCIe/XAUI protocol extensions lets designers implement high-bandwidth links directly in the FPGA fabric.
  • Industrial Temperature Range: Rated for -40 °C to 100 °C operation, suitable for many industrial environments that demand wide temperature tolerance.
  • Security and Supply-Chain Features: Encrypted bitstream loading, device certificate and available cryptographic engines help protect IP and enable secure deployment models.

Why Choose M2GL050T-1FGG484I?

The M2GL050T-1FGG484I combines a high logic element count, substantial embedded memory and extensive I/O in a compact 484-BGA package, making it a solid choice for industrial designs that require configurable logic, secure configuration and high-speed interfaces. Its family-level features for SERDES, DDRx memory controllers and DSP mathblocks provide the building blocks for networking, memory-intensive and signal-processing applications.

This device is suited for engineers and system designers who need a programmable, RoHS-compliant FPGA with industrial temperature capability, flexible voltage operation and on-chip resources that reduce external component needs while supporting secure and high-performance system designs.

Request a quote or submit an inquiry to receive pricing and availability information for the M2GL050T-1FGG484I.

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