M2GL050T-1FGG896
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA |
|---|---|
| Quantity | 434 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 377 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050T-1FGG896 – IGLOO2 FPGA, 896-BGA
The M2GL050T-1FGG896 is a Microchip Technology IGLOO2 family field programmable gate array (FPGA) in an 896-ball BGA package. It combines flash-based FPGA fabric with integrated high-performance communications interfaces and memory subsystems to address demanding embedded logic, DSP and high-speed I/O tasks.
Designed for commercial-grade applications, this device delivers 56,340 logic elements, approximately 1.87 Mbits of embedded RAM, and up to 377 user I/Os, providing a balance of performance, integration and low-power operation across a wide range of system designs.
Key Features
- Core Logic 56,340 logic elements implemented in efficient 4-input LUT fabric with carry chains suitable for high-performance, low-power logic implementations.
- Embedded Memory Approximately 1.87 Mbits of total on-chip RAM complemented by up to 64 KB eSRAM and up to 512 KB embedded nonvolatile memory on the IGLOO2 family architecture.
- DSP and Mathblocks Family architecture includes high-performance mathblocks for DSP—supporting signed and unsigned multiplication with wide accumulators for signal processing workloads.
- High-Speed Serial Interfaces Supports up to 16 SERDES lanes with native SERDES, XGXS/XAUI support and PCIe endpoint capability (x1/x2/x4) as part of the IGLOO2 feature set.
- Memory Interfaces IGLOO2 architecture provides DDR memory controller support (LPDDR/DDR2/DDR3) with up to 333 MHz clock rate and SDRAM support via soft controller.
- Clocking Multiple clock sources and up to 8 Clock Conditioning Circuits (CCCs) with integrated PLLs, supporting input frequencies 1–200 MHz and output frequencies 20–400 MHz.
- Multi-Standard I/Os Support for a wide range of I/O standards including LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVDS and various DDR I/O standards for flexible board-level interfacing.
- Security IGLOO2 family security options include encrypted bitstream loading and device-level anti-tamper and keying features as part of the platform.
- Package & Power 896-ball FBGA (31 × 31) surface-mount package; nominal core voltage referenced at 1.2 V with allowable supply range from 1.14 V to 2.625 V.
- Operating Conditions & Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliant.
Typical Applications
- High-Speed Communications Use the integrated SERDES lanes and PCIe support to implement Ethernet, PCIe endpoints or other serial communication links.
- Memory Interface and Bridging Leverage the DDRx memory controllers and embedded buffering to implement high-bandwidth memory interfaces and protocol bridges.
- DSP and Signal Processing Deploy the mathblocks and on-chip RAM for FFTs, filters and mixed-signal processing tasks in communications and instrumentation equipment.
- Secure Embedded Systems Use encrypted bitstream loading and device security features to protect intellectual property and enable secure deployment models.
Unique Advantages
- Highly Integrated Platform: Combines logic, DSP mathblocks, multiple embedded memory types and high-speed I/O in a single device to reduce BOM and board complexity.
- Flexible I/O and Interfaces: Wide range of user I/O standards plus up to 16 SERDES lanes and PCIe support enable diverse board-level connectivity without external transceivers.
- Embedded Memory Density: Approximately 1.87 Mbits of on-chip RAM plus eSRAM and eNVM options accelerate data buffering and state retention for complex designs.
- Security and IP Protection: Encrypted bitstream loading and anti-tamper features support deployment in less-trusted locations and protect design IP.
- Commercial Temperature and RoHS Compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance support standard embedded and communications products.
Why Choose M2GL050T-1FGG896?
The M2GL050T-1FGG896 delivers a balanced combination of logic density, embedded memory, DSP capability and high-speed serial interfaces in an 896-ball FBGA package. It is well suited for designs that require integrated memory controllers, SERDES connectivity and security features within a commercial-temperature FPGA solution.
Engineers building communications equipment, memory-interfacing subsystems, signal-processing modules or secure embedded devices can leverage the IGLOO2 architecture’s integration to simplify system design, reduce component count and accelerate time to market.
Request a quote or submit an inquiry to get pricing and availability for M2GL050T-1FGG896 and to discuss how this IGLOO2 FPGA can fit your next design.

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