M2GL050T-1FGG896

IC FPGA 377 I/O 896FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

Quantity 434 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O377Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050T-1FGG896 – IGLOO2 FPGA, 896-BGA

The M2GL050T-1FGG896 is a Microchip Technology IGLOO2 family field programmable gate array (FPGA) in an 896-ball BGA package. It combines flash-based FPGA fabric with integrated high-performance communications interfaces and memory subsystems to address demanding embedded logic, DSP and high-speed I/O tasks.

Designed for commercial-grade applications, this device delivers 56,340 logic elements, approximately 1.87 Mbits of embedded RAM, and up to 377 user I/Os, providing a balance of performance, integration and low-power operation across a wide range of system designs.

Key Features

  • Core Logic  56,340 logic elements implemented in efficient 4-input LUT fabric with carry chains suitable for high-performance, low-power logic implementations.
  • Embedded Memory  Approximately 1.87 Mbits of total on-chip RAM complemented by up to 64 KB eSRAM and up to 512 KB embedded nonvolatile memory on the IGLOO2 family architecture.
  • DSP and Mathblocks  Family architecture includes high-performance mathblocks for DSP—supporting signed and unsigned multiplication with wide accumulators for signal processing workloads.
  • High-Speed Serial Interfaces  Supports up to 16 SERDES lanes with native SERDES, XGXS/XAUI support and PCIe endpoint capability (x1/x2/x4) as part of the IGLOO2 feature set.
  • Memory Interfaces  IGLOO2 architecture provides DDR memory controller support (LPDDR/DDR2/DDR3) with up to 333 MHz clock rate and SDRAM support via soft controller.
  • Clocking  Multiple clock sources and up to 8 Clock Conditioning Circuits (CCCs) with integrated PLLs, supporting input frequencies 1–200 MHz and output frequencies 20–400 MHz.
  • Multi-Standard I/Os  Support for a wide range of I/O standards including LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVDS and various DDR I/O standards for flexible board-level interfacing.
  • Security  IGLOO2 family security options include encrypted bitstream loading and device-level anti-tamper and keying features as part of the platform.
  • Package & Power  896-ball FBGA (31 × 31) surface-mount package; nominal core voltage referenced at 1.2 V with allowable supply range from 1.14 V to 2.625 V.
  • Operating Conditions & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • High-Speed Communications  Use the integrated SERDES lanes and PCIe support to implement Ethernet, PCIe endpoints or other serial communication links.
  • Memory Interface and Bridging  Leverage the DDRx memory controllers and embedded buffering to implement high-bandwidth memory interfaces and protocol bridges.
  • DSP and Signal Processing  Deploy the mathblocks and on-chip RAM for FFTs, filters and mixed-signal processing tasks in communications and instrumentation equipment.
  • Secure Embedded Systems  Use encrypted bitstream loading and device security features to protect intellectual property and enable secure deployment models.

Unique Advantages

  • Highly Integrated Platform: Combines logic, DSP mathblocks, multiple embedded memory types and high-speed I/O in a single device to reduce BOM and board complexity.
  • Flexible I/O and Interfaces: Wide range of user I/O standards plus up to 16 SERDES lanes and PCIe support enable diverse board-level connectivity without external transceivers.
  • Embedded Memory Density: Approximately 1.87 Mbits of on-chip RAM plus eSRAM and eNVM options accelerate data buffering and state retention for complex designs.
  • Security and IP Protection: Encrypted bitstream loading and anti-tamper features support deployment in less-trusted locations and protect design IP.
  • Commercial Temperature and RoHS Compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance support standard embedded and communications products.

Why Choose M2GL050T-1FGG896?

The M2GL050T-1FGG896 delivers a balanced combination of logic density, embedded memory, DSP capability and high-speed serial interfaces in an 896-ball FBGA package. It is well suited for designs that require integrated memory controllers, SERDES connectivity and security features within a commercial-temperature FPGA solution.

Engineers building communications equipment, memory-interfacing subsystems, signal-processing modules or secure embedded devices can leverage the IGLOO2 architecture’s integration to simplify system design, reduce component count and accelerate time to market.

Request a quote or submit an inquiry to get pricing and availability for M2GL050T-1FGG896 and to discuss how this IGLOO2 FPGA can fit your next design.

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