M2GL050T-1FGG896I

IC FPGA 377 I/O 896FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

Quantity 201 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BGANumber of I/O377Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050T-1FGG896I – IGLOO2 Field Programmable Gate Array (FPGA)

The M2GL050T-1FGG896I is an IGLOO2 series flash-based FPGA from Microchip Technology, delivered in a 896-ball FBGA (31 × 31) package and specified for industrial operation. It combines programmable logic, a substantial I/O count and embedded memory to support mid-density FPGA designs that require flexible I/O, on-chip RAM and low-power operation across a wide supply range.

Targeted at applications that demand configurable logic with robust interfacing, this device provides 56,340 logic elements, approximately 1.87 Mbits of embedded RAM, and 377 user I/Os — enabling complex glue logic, protocol bridging, memory interfacing and DSP-accelerated functions within industrial temperature environments.

Key Features

  • Logic Capacity — 56,340 logic elements for implementing moderate-complexity programmable logic and control functions.
  • Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
  • I/O and Package — 377 user I/Os presented in a 896-FBGA (31 × 31) package for high pin-count designs and compact PCB layouts.
  • Power and Voltage — Operates across a 1.14 V to 2.625 V supply range to match diverse I/O standards and core requirements.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C, suitable for industrial deployments.
  • Family-Level High-Speed Interfaces — IGLOO2 family features include support for high-speed serial links (up to 16 SERDES lanes), PCIe endpoint cores and XAUI/XGXS interfaces, useful for high-bandwidth communications when implemented.
  • Memory Controller Options — IGLOO2 architecture provides DDRx memory controller support (DDR2/DDR3/LPDDR) with maximum memory clocking noted at the family level, enabling high-speed external memory interfacing where required.
  • DSP and Math Resources — Family-level mathblocks and DSP resources (up to 240 mathblocks) are available for multiply-accumulate and signal-processing functions when used in designs targeting these capabilities.
  • Security and Reliability Features — IGLOO2 family includes design and data security capabilities such as encrypted bitstream loading, anti-tamper features and device certificate options at the family level.

Typical Applications

  • Industrial Control — Implement motor control logic, protocol conversion and local sequencing leveraging the device’s logic capacity and industrial temperature rating.
  • High-Speed Communications — Use family-level SERDES, PCIe and XAUI/XGXS support to implement serial links, protocol bridging or PHY interfacing in networking and telecom modules.
  • Memory Interface and Buffering — Integrate DDRx memory controllers and on-chip RAM for data buffering, packet buffering or frame storage in embedded systems.
  • Signal Processing Acceleration — Apply the available mathblocks and embedded RAM for DSP tasks such as filtering, aggregation or checksum offload in measurement and data-acquisition systems.

Unique Advantages

  • Balanced Logic and Memory: 56,340 logic elements paired with approximately 1.87 Mbits of embedded RAM provide a versatile platform for mixed control, interfacing and local data storage.
  • Wide I/O Count in Compact Package: 377 user I/Os in an 896-FBGA (31 × 31) package simplify designs that require many external connections without excessively large PCBs.
  • Flexible Supply Range: 1.14 V to 2.625 V operation supports multiple core and I/O voltage domains, easing integration with diverse peripherals and memory devices.
  • Designed for Industrial Environments: −40 °C to 100 °C operating range aligns with industrial deployment requirements for robustness across temperature extremes.
  • Family-Level High-Speed and Security Options: Access to IGLOO2 family features such as multi-lane SERDES, DDRx memory controllers and encrypted bitstream options enables scalable designs with enhanced connectivity and security when needed.

Why Choose M2GL050T-1FGG896I?

The M2GL050T-1FGG896I positions itself as a capable mid-density FPGA option for engineers who need a balanced combination of logic resources, on-chip RAM and a large I/O count in a compact BGA package. Its supported supply voltage range and industrial temperature rating make it suitable for embedded systems that must interface with a variety of peripherals and operate reliably across temperature extremes.

Designers seeking to implement serial communications, memory interfacing or DSP-accelerated tasks can leverage the IGLOO2 family capabilities alongside the device’s specific resources to create scalable, serviceable solutions with enhanced security and on-chip integration.

Request a quote or submit an inquiry to get pricing and availability for M2GL050T-1FGG896I and to discuss how this IGLOO2 FPGA can fit into your next design.

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