M2GL050T-1FCSG325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA |
|---|---|
| Quantity | 508 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050T-1FCSG325I – IGLOO2 Field Programmable Gate Array (FPGA), 200 I/Os, 325-TFBGA
The M2GL050T-1FCSG325I is an IGLOO2 family FPGA offering a mid-range programmable logic resource set in a 325-TFBGA package. It combines 56,340 logic elements with approximately 1.87 Mbits of embedded memory and up to 200 general-purpose I/O pins for flexible system integration.
Designed for industrial-grade applications, this surface-mount FPGA supports a wide supply range and extended operating temperatures, making it suitable for designs that require dense logic, moderate on-chip RAM, and a large I/O complement within a compact FCBGA footprint.
Key Features
- Logic Capacity 56,340 logic elements provide programmable resources for implementing combinational and sequential logic, state machines, and custom hardware functions.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, FIFO structures, and small data storage without external memory.
- I/O Density Up to 200 I/O pins enable connectivity to multiple peripherals, sensors, and external devices in I/O-intensive designs.
- Power Supply Flexibility Operates over a wide supply range from 1.14 V to 2.625 V to accommodate different system power architectures and IO standards.
- Package and Mounting 325-TFBGA (325-FCBGA, 11×11) surface-mount package provides a compact footprint for space-constrained boards.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial environments.
- Environmental Compliance RoHS compliant for designs requiring lead-free and environmentally conscious components.
Typical Applications
- Embedded Systems — Use the programmable logic and on-chip RAM to implement custom peripherals, protocol handling, and control logic in compact embedded designs.
- Industrial Control — The industrial temperature rating and flexible I/O make it suitable for automation, motor control interfaces, and factory equipment control modules.
- Communications and Interfaces — High I/O count supports multi-channel interfaces, protocol bridging, and I/O aggregation in communication equipment.
- Prototyping and Custom Hardware — A reliable platform for developing and validating custom logic blocks and system prototypes that require significant logic resources and embedded memory.
Unique Advantages
- Substantial Logic Resources: 56,340 logic elements provide room to implement complex state machines, datapaths, and control logic without immediate need for external devices.
- On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage, simplifying board design.
- High I/O Count: 200 available I/Os enable direct connection to multiple sensors, actuators, and peripherals, lowering the need for external multiplexing logic.
- Wide Supply Voltage Support: Operation from 1.14 V to 2.625 V allows integration into varied power domains and supports different IO voltage requirements.
- Industrial-Rated Operation: −40 °C to 100 °C operating range supports deployment in harsher environments where industrial performance is required.
- Compact BGA Packaging: 325-TFBGA (11×11 FCBGA) keeps board area and profile low while providing a high pin count for dense system designs.
Why Choose M2GL050T-1FCSG325I?
The M2GL050T-1FCSG325I positions itself as a robust mid-range IGLOO2 FPGA option that balances sizable programmable logic, embedded memory, and a large I/O complement within a compact BGA package. Its industrial temperature rating and wide supply voltage range make it a practical choice for designers who need dependable programmable logic in demanding environments.
This device is well suited for engineers developing embedded control systems, I/O-heavy interfaces, and custom hardware accelerators where on-chip resources reduce BOM complexity and simplify PCB design. Its RoHS compliance and surface-mount BGA package support modern manufacturing and environmental requirements.
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