M2GL050T-1FCSG325I

IC FPGA 200 I/O 324CSBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA

Quantity 508 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case325-TFBGA, FCBGANumber of I/O200Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050T-1FCSG325I – IGLOO2 Field Programmable Gate Array (FPGA), 200 I/Os, 325-TFBGA

The M2GL050T-1FCSG325I is an IGLOO2 family FPGA offering a mid-range programmable logic resource set in a 325-TFBGA package. It combines 56,340 logic elements with approximately 1.87 Mbits of embedded memory and up to 200 general-purpose I/O pins for flexible system integration.

Designed for industrial-grade applications, this surface-mount FPGA supports a wide supply range and extended operating temperatures, making it suitable for designs that require dense logic, moderate on-chip RAM, and a large I/O complement within a compact FCBGA footprint.

Key Features

  • Logic Capacity 56,340 logic elements provide programmable resources for implementing combinational and sequential logic, state machines, and custom hardware functions.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, FIFO structures, and small data storage without external memory.
  • I/O Density Up to 200 I/O pins enable connectivity to multiple peripherals, sensors, and external devices in I/O-intensive designs.
  • Power Supply Flexibility Operates over a wide supply range from 1.14 V to 2.625 V to accommodate different system power architectures and IO standards.
  • Package and Mounting 325-TFBGA (325-FCBGA, 11×11) surface-mount package provides a compact footprint for space-constrained boards.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial environments.
  • Environmental Compliance RoHS compliant for designs requiring lead-free and environmentally conscious components.

Typical Applications

  • Embedded Systems — Use the programmable logic and on-chip RAM to implement custom peripherals, protocol handling, and control logic in compact embedded designs.
  • Industrial Control — The industrial temperature rating and flexible I/O make it suitable for automation, motor control interfaces, and factory equipment control modules.
  • Communications and Interfaces — High I/O count supports multi-channel interfaces, protocol bridging, and I/O aggregation in communication equipment.
  • Prototyping and Custom Hardware — A reliable platform for developing and validating custom logic blocks and system prototypes that require significant logic resources and embedded memory.

Unique Advantages

  • Substantial Logic Resources: 56,340 logic elements provide room to implement complex state machines, datapaths, and control logic without immediate need for external devices.
  • On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage, simplifying board design.
  • High I/O Count: 200 available I/Os enable direct connection to multiple sensors, actuators, and peripherals, lowering the need for external multiplexing logic.
  • Wide Supply Voltage Support: Operation from 1.14 V to 2.625 V allows integration into varied power domains and supports different IO voltage requirements.
  • Industrial-Rated Operation: −40 °C to 100 °C operating range supports deployment in harsher environments where industrial performance is required.
  • Compact BGA Packaging: 325-TFBGA (11×11 FCBGA) keeps board area and profile low while providing a high pin count for dense system designs.

Why Choose M2GL050T-1FCSG325I?

The M2GL050T-1FCSG325I positions itself as a robust mid-range IGLOO2 FPGA option that balances sizable programmable logic, embedded memory, and a large I/O complement within a compact BGA package. Its industrial temperature rating and wide supply voltage range make it a practical choice for designers who need dependable programmable logic in demanding environments.

This device is well suited for engineers developing embedded control systems, I/O-heavy interfaces, and custom hardware accelerators where on-chip resources reduce BOM complexity and simplify PCB design. Its RoHS compliance and surface-mount BGA package support modern manufacturing and environmental requirements.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for the M2GL050T-1FCSG325I.

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