M2GL050TS-1FGG896
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA |
|---|---|
| Quantity | 372 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 377 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-1FGG896 – IGLOO2 Field Programmable Gate Array (FPGA) 896-BGA
The M2GL050TS-1FGG896 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology. It delivers a mid-range programmable-logic solution with a balance of logic capacity, embedded memory and dense I/O for commercial applications.
With 56,340 logic elements, approximately 1.87 Mbits of on-chip RAM and support for up to 377 I/O, this surface-mount FPGA is intended for designs that require flexible digital logic, embedded memory and a compact 896-ball BGA package.
Key Features
- Logic Resources — 56,340 logic elements provide programmable logic capacity for custom digital functions and control logic.
- Embedded Memory — Approximately 1.87 Mbits of on-chip RAM enables local data buffering and state storage without external memory.
- I/O Density — Up to 377 I/O pins support a wide range of interfaces and parallel connectivity in a single device.
- Power Supply Range — Supports core and I/O operation across a supply range of 1.14 V to 2.625 V, allowing use in varied power architectures.
- Package & Mounting — 896-ball BGA (supplier package: 896-FBGA, 31×31) in a surface-mount form factor for high-density board designs.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for standard commercial environments.
- Regulatory — RoHS-compliant for lead-free manufacturing and environmental compliance.
Typical Applications
- Programmable Logic Integration — Implement custom digital functions and control logic using 56,340 logic elements and embedded RAM for local data handling.
- Interface Aggregation — Consolidate multiple parallel and serial interfaces using up to 377 I/O to simplify board-level connectivity.
- Embedded Control — Deploy the FPGA for on-board state machines, protocol handling and glue logic where integrated memory and reconfigurability are needed.
Unique Advantages
- Significant Logic Capacity: 56,340 logic elements enable substantial custom logic implementation without moving to larger device families.
- On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and layout.
- High I/O Count: 377 available I/O pins provide flexibility to interface with multiple peripherals and subsystems directly.
- Compact BGA Package: The 896-ball BGA (31×31) enables high pin density in a space-efficient footprint for compact designs.
- Wide Supply Range: Operates across 1.14 V to 2.625 V, accommodating varied power schemes and interfacing requirements.
- Commercial Qualification: Rated for 0 °C to 85 °C operation and RoHS-compliant for standard commercial deployments.
Why Choose M2GL050TS-1FGG896?
The M2GL050TS-1FGG896 positions itself as a versatile IGLOO2 FPGA for designers who need a balanced combination of logic capacity, on-chip memory and dense I/O in a compact BGA package. Its specifications make it well suited for commercial embedded systems that require reconfigurable logic, localized memory, and multiple interface connections.
Manufactured by Microchip Technology and provided in a surface-mount 896-BGA package, this FPGA offers a practical, RoHS-compliant option for teams targeting robust, scalable digital designs within the 0 °C to 85 °C commercial temperature envelope.
Request a quote or submit an inquiry to receive pricing and availability for the M2GL050TS-1FGG896. Our team can provide lead-time and ordering details to support your project schedule.

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