M2GL050TS-1FG896I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA |
|---|---|
| Quantity | 354 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 377 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-1FG896I – IGLOO2 Field Programmable Gate Array (FPGA), 896-FBGA
The M2GL050TS-1FG896I is an IGLOO2 family flash-based FPGA optimized for low-power, secure embedded and communications designs. It combines IGLOO2 architecture elements—including 4-input LUT fabric with carry chains and integrated memory/DSP resources—with a high-pin-count 896-FBGA package, making it suitable for applications that require moderate logic capacity, extensive I/O, and industrial temperature operation.
Key Features
- Core Architecture: 4-input LUT fabric with carry chains derived from the IGLOO2 family, delivering a modern, flash-based FPGA architecture designed for efficiency and reliability.
- Logic Capacity: Approximately 56,340 logic elements to implement mid-scale digital logic and control functions.
- Embedded Memory & DSP: Approximately 1.87 Mbits of on-chip RAM (total RAM bits: 1,869,824) and family-level DSP/mathblock support to accelerate signal processing and arithmetic tasks.
- I/O and High-Speed Connectivity: Up to 377 user I/Os available for flexible interfacing in a wide range of system designs.
- Package & Mounting: 896-FBGA (31×31 mm) ball-grid array, surface mount package for high-density board integration.
- Supply & Temperature Range: Wide supply range from 1.14 V to 2.625 V and industrial operating temperature from −40 °C to 100 °C for harsh-environment suitability.
- Security & Reliability (IGLOO2 family): Family-level features include flash-based nonvolatile configuration, encrypted bitstream options, and anti-tamper capabilities to support secure deployment models.
- Standards Compliance: RoHS-compliant device supporting environmental and manufacturing requirements.
Typical Applications
- Industrial Control & Automation: Implement motor control, protocol conversion, and deterministic logic functions using the device’s logic capacity and industrial temperature rating.
- Communications & Networking: Use the FPGA’s extensive I/O and IGLOO2 family high-speed interface support to implement PHY/bridge functions and packet processing tasks.
- Embedded Signal Processing: Accelerate DSP and filtering algorithms with on-chip memory and family DSP/mathblock capabilities for real-time data handling.
- Secure Edge Devices: Leverage flash-based configuration and family security features for encrypted bitstreams and supply-chain assurance in distributed systems.
Unique Advantages
- Highly Integrated Flash-Based FPGA: Nonvolatile configuration reduces external configuration components and simplifies system boot sequencing.
- Mid-Scale Logic with Significant I/O: Approximately 56,340 logic elements and 377 I/Os provide the balance between logic capacity and board-level connectivity for versatile designs.
- On-Chip Memory for Local Storage: Approximately 1.87 Mbits of embedded RAM enables buffering, state storage, and local data processing without external memory in many use cases.
- Industrial Temperature Operation: Rated from −40 °C to 100 °C to support deployment in extended-temperature industrial environments.
- Compact High-Density Package: 896-FBGA (31×31 mm) packaging supports high I/O counts while conserving PCB area.
- RoHS Compliance: Meets environmental manufacturing requirements for modern production flows.
Why Choose M2GL050TS-1FG896I?
The M2GL050TS-1FG896I delivers a practical blend of mid-scale logic capacity, substantial on-chip RAM, and extensive I/O in a compact 896-FBGA package, backed by IGLOO2 family architecture advantages such as flash-based configuration and family security features. It is well suited for engineers building industrial, communications, and embedded signal-processing systems that require reliable operation across a wide temperature range and flexible interfacing.
For designs that need a balance of integration, security options, and on-chip memory to reduce external component count and simplify system architecture, the M2GL050TS-1FG896I provides a clear implementation path within the IGLOO2 product space.
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