M2GL050TS-1FG896

IC FPGA 377 I/O 896FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

Quantity 1,103 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O377Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050TS-1FG896 – IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

The M2GL050TS-1FG896 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology. It provides a programmable logic fabric with a substantial logic capacity and on-chip memory for mid-range embedded designs.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory, and 377 I/O pins in a compact 896-ball BGA package, this commercial-grade device addresses applications that require a balanced mix of logic, memory, and I/O in a surface-mount form factor while operating across a low-voltage supply range.

Key Features

  • Core Capacity  56,340 logic elements offering programmable logic resources for implementing combinational and sequential logic functions.
  • Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, small data stores, and state machines without external memory.
  • I/O Density  377 available I/O pins to interface with sensors, peripherals, and external logic while enabling flexible board-level connectivity.
  • Power and Voltage  Operates from a supply range of 1.14 V to 2.625 V, supporting low-voltage system designs.
  • Package & Mounting  896-ball BGA package (896-FBGA, 31×31) designed for surface-mount assembly to save board space and support compact layouts.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
  • RoHS Compliance  RoHS-compliant construction for lead-free assembly and regulatory alignment.

Unique Advantages

  • Substantial Logic Resource: 56,340 logic elements provide headroom for complex state machines and custom processing blocks without external programmable devices.
  • On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-storage needs, simplifying BOM and board layout.
  • High I/O Count: 377 I/O pins enable dense peripheral connectivity and flexible pin assignments for mixed-signal and parallel interfaces.
  • Compact BGA Package: 896-ball FBGA (31×31) minimizes PCB footprint while providing the pin count required for higher integration.
  • Low-Voltage Support: 1.14 V to 2.625 V supply range allows integration into modern low-power systems and compatibility with a variety of core and I/O voltage domains.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C for typical commercial applications and environments.

Why Choose M2GL050TS-1FG896?

The M2GL050TS-1FG896 positions itself as a mid-range FPGA option that brings a balanced combination of logic capacity, on-chip memory, and extensive I/O in a compact 896-BGA package. Its low-voltage operation and RoHS compliance make it suitable for contemporary embedded systems where board space and power are considerations.

Backed by Microchip Technology, this FPGA is well suited to engineers and procurement teams seeking a programmable device with substantial on-chip resources and a commercial operating range, offering scalability and integration potential within constrained PCB layouts.

Request a quote or submit an inquiry to receive pricing and availability for the M2GL050TS-1FG896. Our team can provide lead-time details and order support.

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