M2GL050TS-1FCSG325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA |
|---|---|
| Quantity | 115 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-1FCSG325I – IGLOO2 FPGA, 56,340 logic elements, ~1.87 Mbits embedded memory, 200 I/Os, 325‑TFBGA
The M2GL050TS-1FCSG325I is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology. It provides a combination of on-chip logic capacity, embedded memory, and a substantial I/O count in a compact BGA package.
This device is offered in a 325‑TFBGA/FCBGA package and is specified for industrial use, with a wide operating temperature range and broad supply voltage support for diverse embedded and industrial digital designs.
Key Features
- Core Logic Contains 56,340 logic elements suitable for implementing complex custom digital functions.
- Embedded Memory Approximately 1.87 Mbits of on‑chip RAM bits for buffering, data storage, and user logic needs.
- I/O Density Up to 200 user I/Os to support multiple peripheral interfaces and board-level signal routing.
- Power and Voltage Range Operates from 1.14 V to 2.625 V to match a range of system power rails and enable flexible power architectures.
- Package and Mounting 325‑TFBGA / 325‑FCBGA (11×11) in a surface‑mount package to minimize board footprint while providing high pin density.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive industrial environments.
- RoHS Compliant Meets RoHS environmental requirements for lead‑free assembly.
Typical Applications
- Industrial Control Use where industrial temperature operation and on‑chip logic are required for PLC logic, sequencing, or control algorithms.
- Embedded Systems Ideal for custom digital functions and integration thanks to 56,340 logic elements and roughly 1.87 Mbits of embedded memory.
- Communications & Networking High I/O count (200) supports flexible interfacing and board‑level connectivity for networking modules and aggregation devices.
- Sensor Hubs and Data Aggregation On‑chip RAM and logic capacity enable local preprocessing, buffering, and sensor data handling in industrial sensor nodes and aggregator modules.
Unique Advantages
- Significant Logic Capacity: 56,340 logic elements enable substantial custom logic implementation without external programmable devices.
- Substantial On‑Chip Memory: Approximately 1.87 Mbits of embedded RAM supports buffering and state storage for data‑intensive functions.
- Flexible I/O Count: 200 user I/Os provide design flexibility for multiple interfaces and mixed‑signal board layouts.
- Wide Supply Range: 1.14 V to 2.625 V operation allows integration into varied power architectures and reduces the need for additional regulators.
- Industrial Reliability: Specified −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
- Compact BGA Package: 325‑TFBGA / 325‑FCBGA (11×11) reduces PCB area while delivering high pin density for complex designs.
Why Choose M2GL050TS-1FCSG325I?
The M2GL050TS-1FCSG325I delivers a balanced combination of logic density, embedded memory, and I/O flexibility in a compact BGA footprint, tailored for industrial applications that require reliable operation across a wide temperature range. As an IGLOO2 FPGA from Microchip Technology, it is appropriate for designs that need substantial on‑chip resources and robust packaging.
This device is well suited for engineering teams designing industrial control systems, embedded processing modules, communications interfaces, and sensor aggregation solutions where logic capacity, memory and a high number of I/Os are primary selection criteria.
Request a quote or submit an inquiry for the M2GL050TS-1FCSG325I to discuss pricing, availability, and integration details for your project.

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