M2GL050TS-1FCS325
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA |
|---|---|
| Quantity | 430 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-1FCS325 – IGLOO2 Field Programmable Gate Array (FPGA) IC, 200 I/O, 56,340 logic elements, ~1.87 Mbits RAM, 325-TFBGA
The M2GL050TS-1FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high density of logic resources and embedded memory in a compact, surface-mount BGA package.
With 56,340 logic elements, approximately 1.87 Mbits of on-chip RAM, and 200 I/O, this device targets designs that require substantial programmable logic capacity combined with a low-voltage supply range and a commercial temperature rating.
Key Features
- Logic Capacity 56,340 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory Approximately 1.87 Mbits of total RAM bits available for data buffering, state storage, and logic acceleration.
- I/O Count 200 general-purpose I/O pins suitable for multi-channel interfacing and peripheral connectivity.
- Power Supply Supports voltage supply range from 1.14 V to 2.625 V, enabling a range of low-voltage system designs.
- Package and Mounting 325-TFBGA (also listed as 325-FCBGA, 11×11) in a surface-mount form factor for compact board-level integration.
- Temperature and Grade Commercial grade operation with an ambient range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant to meet standard environmental directives for electronic components.
Unique Advantages
- High logic density: 56,340 logic elements enable implementation of sizable custom logic blocks and complex state machines without external PLDs.
- Significant on-chip memory: Approximately 1.87 Mbits of embedded RAM reduces the need for external memory in many buffering and local-storage use cases.
- Rich I/O resources: 200 I/O pins support multi-channel interfacing and flexible signal routing for integration with peripherals and subsystems.
- Compact BGA footprint: 325-TFBGA / 325-FCBGA (11×11) package delivers the logic and memory capacity in a space-efficient surface-mount package.
- Low-voltage operation: Broad supply range from 1.14 V to 2.625 V accommodates a variety of modern low-voltage system architectures.
- RoHS compliant: Meets common environmental compliance requirements for electronic assemblies.
Why Choose M2GL050TS-1FCS325?
The M2GL050TS-1FCS325 positions itself as a high-capacity IGLOO2 FPGA option for designs that need abundant programmable logic, meaningful embedded memory, and a substantial I/O count in a compact BGA package. Its low-voltage supply range and commercial temperature rating make it suitable for a wide range of board-level applications where these specific electrical and mechanical characteristics are required.
For engineers and procurement teams seeking a Microchip Technology IGLOO2 device that balances logic density, embedded RAM, and package integration, this part offers verifiable specifications to match system requirements while adhering to RoHS environmental standards.
Request a quote or submit an inquiry to check availability and pricing for the M2GL050TS-1FCS325.

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