M2GL050TS-1FCSG325
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA |
|---|---|
| Quantity | 1,560 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-1FCSG325 – IGLOO2 Field Programmable Gate Array (FPGA) IC
The M2GL050TS-1FCSG325 is an IGLOO2 field programmable gate array from Microchip Technology, delivering a balance of logic density, embedded memory and I/O in a compact BGA package. With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 200 I/O pins, it addresses designs that require moderate programmable logic capacity with on-chip RAM and a high pin count in a surface-mount footprint.
Key Features
- Logic Capacity 56,340 logic elements provide substantial programmable logic for custom hardware functions and glue logic within compact designs.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage and memory-mapped logic without immediate need for external memory.
- I/O Availability 200 I/O pins to accommodate multiple parallel interfaces, sensor connections or peripheral control lines.
- Power Supply Range Supports a supply voltage range of 1.14 V to 2.625 V to match common FPGA domain voltages and flexible power architectures.
- Package & Mounting Supplied in a 325-TFBGA / 325-FCBGA package (11×11) for surface-mount assembly, enabling dense PCB integration.
- Operating Conditions Commercial grade operation from 0°C to 85°C for standard environment deployments.
- Regulatory Compliance RoHS compliant to support lead-free manufacturing processes.
Typical Applications
- Embedded Systems Use the FPGA’s logic capacity and embedded memory to implement custom control, protocol handling or peripheral interfacing in embedded designs.
- Communications Equipment Leverage 200 I/O pins and on-chip RAM to handle parallel interfaces and buffering tasks in network or connectivity modules.
- Custom Hardware Acceleration Employ the available logic elements and embedded memory to offload compute- or data-intensive functions from a host processor.
Unique Advantages
- High Logic Density: 56,340 logic elements enable substantial custom logic implementations within a single device, reducing system complexity.
- Integrated Memory: Approximately 1.87 Mbits of on-chip RAM can reduce reliance on external memory, shrinking BOM and PCB area.
- Generous I/O Count: 200 I/O pins provide flexibility for multi-channel interfacing and parallel connectivity without supplementary I/O expanders.
- Flexible Power Options: Wide supply voltage range (1.14 V–2.625 V) supports integration into varied power domain architectures.
- Compact Surface-Mount Package: 325-FCBGA (11×11) package delivers a space-efficient footprint for high-density boards.
- RoHS Compliant: Meets lead-free manufacturing requirements for modern production processes.
Why Choose M2GL050TS-1FCSG325?
The M2GL050TS-1FCSG325 IGLOO2 FPGA combines substantial logic resources, embedded memory and a high I/O count in a single 325-FCBGA surface-mount package, making it well suited to designs that require moderate programmable logic density with on-chip RAM and robust interfacing. Its commercial operating range and flexible supply voltage make it appropriate for a range of standard electronic products where integration and board-space efficiency are priorities.
For teams looking to scale designs with programmable logic while minimizing external components, this IGLOO2 device offers clear, verifiable capacity and packaging characteristics supported by Microchip Technology.
Request a quote or submit a procurement inquiry to obtain pricing, lead time and availability for the M2GL050TS-1FCSG325.

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