M2GL050TS-1FCS325I

The M2GL050TS-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for embedded and industrial designs that require a balance of logic capacity, on-chip memory and I/O density. Built for surface-mount deployment in a 325-ball FCBGA package, this device targets applications that need configurable logic, substantial embedded memory and robust operating conditions.

Key value comes from its combination of 56,340 logic elements, approximately 1.87 Mbits of embedded RAM, and 200 user I/Os, along with an industrial temperature rating and RoHS compliance to support long-term, regulated deployments.

Key Features

• Core Logic  56,340 logic elements provide a substantial programmable fabric for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM for state, buffering and local storage of data within user logic.
• I/O Density  200 user I/Os allow wide connectivity to peripherals, sensors and external interfaces without the need for external multiplexing.
• Power Supply Flexibility  Supports supply voltages from 1.14 V to 2.625 V, accommodating a range of system power architectures and logic-level requirements.
• Package and Mounting  Available in a 325-TFBGA / 325-FCBGA (11×11) package optimized for surface-mount assembly in compact designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet environmental demands in industrial deployments.
• Regulatory Compliance  RoHS compliant for environmental and manufacturing standards alignment.

Typical Applications

• Industrial Control  Implementation of custom control logic, sequencing and I/O aggregation in factory automation and process control equipment using the device's industrial temperature rating and I/O capacity.
• Embedded Processing and Prototyping  Platform for prototyping system logic, custom accelerators or glue logic in embedded systems that require programmable resources and local memory.
• I/O‑Rich Interface Modules  Ideal for modules that need to manage many signals or peripherals directly, leveraging the 200 I/Os to minimize external bridging components.

Unique Advantages

• High Logic Integration: 56,340 logic elements enable complex digital designs within a single FPGA device, reducing part count.
• On‑Chip Memory Density: Approximately 1.87 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Generous I/O Count: 200 user I/Os simplify system integration by providing direct connections to sensors, actuators and peripherals.
• Industrial Reliability: Rated −40 °C to 100 °C for applications that require extended temperature operation.
• Flexible Power Range: Operation across 1.14 V to 2.625 V supports a variety of system power schemes and IO standards.
• Compact Surface-Mount Package: 325-FCBGA (11×11) package enables high-density board designs with industry-standard SMT assembly.

Why Choose M2GL050TS-1FCS325I?

The M2GL050TS-1FCS325I provides a balanced combination of logic capacity, embedded memory and I/O density suited for industrial and embedded applications. Its IGLOO2 FPGA architecture delivers the programmable flexibility needed to consolidate custom logic, interface handling and local data buffering into a single device, while the industrial temperature rating and RoHS compliance support deployment in regulated and harsh environments.

This part is a strong choice for designers seeking a scalable, reliable FPGA solution for mid-density logic implementations where on-chip memory, extensive I/O and compact surface-mount packaging are important selection criteria.

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