M2GL060-1FGG676

The M2GL060-1FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology provided in a 676-BGA surface-mount package. It delivers a combination of logic density, on-chip memory, and I/O capacity for commercial embedded designs.

With 56,520 logic elements, 387 I/Os and approximately 1.87 Mbits of embedded memory, this device targets applications that require substantial programmable logic and I/O routing within a commercial temperature range and a 676-FBGA (27×27) footprint.

Key Features

• Logic Capacity 56,520 logic elements provide substantial programmable resources for complex digital functions.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive logic blocks.
• I/O Count 387 I/Os for broad interfacing options and flexible signal routing in compact systems.
• Package and Mounting 676-BGA / 676-FBGA (27×27) package designed for surface-mount PCB assembly.
• Power Supply Range Operates from 1.14 V to 2.625 V, enabling compatibility with a range of system power architectures.
• Operating Temperature Commercial grade: 0 °C to 85 °C for standard commercial-environment deployments.
• Regulatory Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• General-purpose programmable logic — Use the device where a high count of logic elements and embedded RAM are needed to implement custom digital functions.
• High-density I/O systems — Suitable for designs that require many external interfaces, taking advantage of the 387 available I/Os.
• Embedded data buffering and control — The on-chip memory supports buffering, FIFOs, and state machines within compact FPGA-based subsystems.

Unique Advantages

• High logic density: 56,520 logic elements allow consolidation of complex logic that would otherwise require multiple discrete devices.
• Substantial on-chip memory: Approximately 1.87 Mbits of RAM reduces the need for external memory in many designs, simplifying BOM and layout.
• Extensive I/O count: 387 I/Os enable flexible interfacing and reduce the need for additional interface chips.
• Compact BGA footprint: 676-FBGA (27×27) package provides a high-pin-count solution in a space-efficient form factor suitable for surface-mount assembly.
• Wide supply compatibility: Support for 1.14 V to 2.625 V supplies facilitates integration into diverse power architectures.
• Commercial temperature suitability: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.

Why Choose M2GL060-1FGG676?

The M2GL060-1FGG676 balances significant programmable logic capacity, substantial embedded RAM, and a high I/O count in a compact 676-BGA package, making it well suited for commercial embedded designs that demand integration and flexibility. Its electrical and thermal ratings align with standard commercial systems and board-level assembly processes.

This device is appropriate for engineers and procurement teams designing mid- to high-complexity FPGA implementations that require on-chip memory and broad interfacing without moving beyond commercial temperature and supply constraints.

Request a quote or submit an inquiry to obtain pricing and availability for the M2GL060-1FGG676.