M2GL060-1FGG484T1

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56520 484-BGA

Quantity 103 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 135°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56520Number of Logic Elements/Cells56520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits1869824

Overview of M2GL060-1FGG484T1 – IGLOO2 Field Programmable Gate Array (FPGA) IC, 484-BGA

The M2GL060-1FGG484T1 is a Microchip IGLOO2 flash-based FPGA in a 484-ball FPBGA (23×23) package. Built on the IGLOO2 architecture, the device combines a high-performance 4-input LUT fabric with extensive embedded memory, DSP mathblocks and multi-gigabit serial interfaces to address applications requiring low power, high integration and enhanced security.

Targeted at automotive and high-reliability markets, this device offers a broad I/O set and a wide operating temperature range, making it suitable for compact, performance-sensitive designs that require AEC-Q100 qualification.

Key Features

  • Logic Capacity — 56,520 logic elements (logic cells) for implementing complex custom logic and control functions.
  • Embedded Memory — Approximately 1.87 Mbits of on-chip RAM plus support in the family for large dual-port 18 Kbit SRAM blocks and micro SRAM arrays, enabling high-bandwidth buffering and local data storage.
  • High-Performance DSP — Family-level support for up to 240 mathblocks with 18×18 signed multiplication and wide accumulators for signal processing workloads.
  • High-Speed Serial Interfaces — Family-level support for up to 16 SERDES lanes and protocol support including PCIe endpoint (x1/x2/x4) and XAUI/XGXS, enabling networking and high-speed data links.
  • Memory Controllers — Family-level DDRx controllers supporting LPDDR/DDR2/DDR3 with maximum 333 MHz clock rate, suitable for designs requiring external DRAM interfaces.
  • Security and Anti-Tamper — Built-in design security features such as encrypted bitstream support, device certificates, zeroization and optional data-security primitives on premium devices.
  • Automotive Grade & Qualification — AEC-Q100 qualified and specified as Automotive grade with an extended operating temperature range of −40°C to 135°C.
  • I/O and Voltage — 267 user I/Os with multi-standard I/O support and a supply voltage range from 1.14 V to 2.625 V; package: 484-FPBGA (23×23).

Typical Applications

  • Automotive Electronics: Compute and interface functions in automotive systems that demand AEC-Q100 qualification and extended temperature operation, such as control nodes and secure telematics modules.
  • High-Speed Communications: Network interface and protocol offload using SERDES lanes and PCIe endpoint capability for line cards, gateways and data aggregation.
  • Embedded Processing with External Memory: Systems that require DDRx memory interfaces and on-chip SRAM for buffering and deterministic data movement.
  • Secure Embedded Systems: Applications requiring encrypted bitstream loading, device certificates and anti-tamper capabilities for IP protection and secure provisioning.

Unique Advantages

  • High Logic Density: 56,520 logic elements provide ample resources to consolidate multiple functions into a single FPGA, reducing BOM and board area.
  • Integrated Memory Resources: Approximately 1.87 Mbits of embedded RAM plus family-level large SRAM options enable local data buffering and low-latency storage for performance-critical tasks.
  • Automotive-Ready Qualification: AEC-Q100 qualification and a −40°C to 135°C operating range support deployment in temperature-extreme and safety-conscious automotive environments.
  • Versatile I/O and Voltage Support: 267 multi-standard I/Os and a wide supply voltage range provide design flexibility for mixed-voltage systems and multiple peripheral interfaces.
  • Security Features: Encrypted key and bitstream support, device certificates and anti-tamper functions help protect IP and enable deployment in supply-chain-sensitive applications.
  • Scalable High-Speed Connectivity: Family-level SERDES, PCIe and DDRx controller support enable scalable connectivity and memory architectures for I/O- and bandwidth-intensive designs.

Why Choose M2GL060-1FGG484T1?

The M2GL060-1FGG484T1 combines substantial logic capacity, embedded memory resources and a rich set of connectivity and security features in a compact 484-FPBGA package. Its AEC-Q100 qualification and extended temperature range make it appropriate for demanding automotive and high-reliability applications where integration, security and long-term robustness matter.

This device is well suited for engineers who need to consolidate functionality, implement secure boot and IP protection, and support high-speed interfaces alongside external DDR memory—while maintaining the temperature and qualification standards required by automotive applications.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the M2GL060-1FGG484T1.

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