M2GL060-1FG676

The M2GL060-1FG676 is an IGLOO2 Field Programmable Gate Array from Microchip Technology designed for commercial embedded applications. This FPGA provides a balance of logic capacity, on-chip memory, and I/O count in a compact 676-FBGA (27×27) package for surface-mount PCB integration.

With 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 387 user I/O, the device targets designs that require mid-to-high density programmable logic with flexible voltage and temperature operation.

Key Features

• Logic Capacity  56,520 logic elements provide a substantial fabric for implementing complex digital designs and custom logic functions.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM supports buffering, lookup tables, and state storage directly in the FPGA fabric.
• I/O Density  387 user I/O pins accommodate multiple interfaces, high-channel counts, and flexible board-level connectivity.
• Power  Wide supply range: 1.14 V to 2.625 V allows integration into varied power architectures and interfacing scenarios.
• Package & Mounting  676-FBGA (27×27) package in a 676-BGA footprint, designed for surface-mount assembly on standard PCBs.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Communications and Networking  Protocol bridging, packet handling, or custom interface logic that benefit from the device's logic density and ample I/O.
• Industrial Control  Control logic, signal routing, and I/O aggregation in commercial industrial systems operating within the specified temperature range.
• Test & Measurement  Data acquisition front-ends and control logic that use on-chip RAM for buffering and the FPGA fabric for real-time processing.
• Embedded Systems  Custom SoC glue logic, peripheral controllers, and interface conversion where a mid-to-high density FPGA is required.

Unique Advantages

• Substantial Logic Resources: 56,520 logic elements give designers room to implement complex functions without external glue logic.
• On‑Chip Memory for Efficient Designs: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• High I/O Count: 387 I/O pins enable integration of multiple interfaces and sensors directly to the FPGA fabric, simplifying board-level routing.
• Flexible Power Integration: A 1.14 V to 2.625 V supply range supports a variety of power schemes and voltage domains on the host board.
• Compact Surface-Mount Package: 676-FBGA (27×27) packaging provides high pin density in a footprint optimized for modern PCB layouts.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in typical commercial environments.

Why Choose M2GL060-1FG676?

The M2GL060-1FG676 IGLOO2 FPGA combines a large programmable fabric, substantial embedded memory, and a high I/O count in a surface-mount 676-FBGA package, making it well suited for commercial embedded designs that need scalable logic capacity and flexible interfacing. Its supply voltage flexibility and RoHS compliance simplify integration into a range of board-level power and manufacturing requirements.

This device is a practical choice for engineering teams building communication, control, or measurement systems where on-chip resources and pin count directly reduce external components and overall BOM complexity. Microchip’s IGLOO2 offering positions this part as a robust option for mid-to-high density FPGA implementations within commercial temperature ranges.

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