M2GL060-1FCSG325I

The M2GL060-1FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides 56,520 logic elements and approximately 1.87 Mbits of embedded memory in a compact surface-mount 325-TFBGA / 325-FCBGA (11×11) package.

With up to 200 I/O, an operating voltage range of 1.14 V to 2.625 V and an industrial operating temperature range of −40 °C to 100 °C, this device is specified for applications that demand high integration, significant I/O capacity, and extended-temperature operation.

Key Features

• Core Logic — 56,520 logic elements provide substantial programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage, and local memory needs.
• I/O and Packaging — Up to 200 I/O pins in a 325-TFBGA package; supplier device package listed as 325-FCBGA (11×11) for high-density board designs.
• Power — Flexible supply voltage range from 1.14 V to 2.625 V to accommodate different power-rail architectures and low-voltage systems.
• Thermal and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Mounting and Compliance — Surface-mount package suitable for compact PCB assembly; RoHS compliant.

Typical Applications

• Industrial Control — Industrial-grade temperature range and robust logic density enable control, sequencing, and deterministic processing in factory and process automation equipment.
• I/O-Intensive Interface Bridging — Up to 200 I/O pins support dense peripheral interfacing, protocol bridging, and custom I/O implementations.
• Embedded Logic and Acceleration — Large logic element count and on-chip memory support custom accelerators, glue logic, and embedded processing functions within compact systems.
• Space-Constrained, High-Density Designs — 325-FCBGA surface-mount package (11×11) enables high-functional-density PCBs where board area is limited.

Unique Advantages

• High Logic Density: 56,520 logic elements allow implementation of complex state machines, datapaths, and custom logic blocks without external devices.
• On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for many mid-sized buffering and state storage needs.
• Generous I/O Count: Up to 200 I/O pins provide flexibility for multiple interfaces, sensors, and peripheral connections on a single device.
• Wide Supply Range: 1.14 V to 2.625 V support enables integration into a variety of power architectures, including low-voltage systems.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation for reliable performance across harsh environmental conditions.
• Compact Surface-Mount Package: 325-FCBGA (11×11) package supports high-density PCB layouts while maintaining a small footprint.

Why Choose M2GL060-1FCSG325I?

The M2GL060-1FCSG325I positions itself as a high-capacity, industrial-grade IGLOO2 FPGA option that balances large programmable logic resources, embedded memory, and a substantial I/O complement in a compact surface-mount package. Its wide supply voltage window and extended operating temperature range make it suitable for designs that require both integration and environmental robustness.

This device is well suited for engineers and procurement teams designing embedded and industrial systems that need a high-density FPGA with significant on-chip RAM and I/O capability, packaged for space-efficient board implementations.

Request a quote or submit a supply inquiry to receive pricing and availability information for the M2GL060-1FCSG325I.