M2GL060-1FCS325I

The M2GL060-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded applications. It provides a large logic fabric paired with on-chip memory and extensive I/O capability for complex logic integration and system interfacing.

Key hardware characteristics include 56,520 logic elements, approximately 1.87 Mbits of embedded RAM, 200 I/Os, a compact 325-FCBGA (11×11) surface-mount package, a broad supply voltage range (1.14 V to 2.625 V) and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core & Logic 56,520 logic elements (cells) provide substantial capacity for implementing custom logic, state machines, and hardware accelerators.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, FIFOs, and data processing without external memory in many designs.
• I/O Count 200 programmable I/Os to support extensive peripheral connectivity, bus interfaces, and multi-channel signal aggregation.
• Power Supply Flexibility Operates across a supply range of 1.14 V to 2.625 V to accommodate a variety of system voltage domains and power architectures.
• Package & Mounting 325-TFBGA / 325-FCBGA (11×11) surface-mount package suitable for compact PCB layouts and automated assembly.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, enabling deployment in harsh environments.
• Regulatory RoHS compliant for environmental and manufacturing regulatory requirements.

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating, high logic capacity, and large I/O count for machine control, PLC functions, and deterministic logic tasks.
• Embedded Processing & Interface Bridging — Implement custom protocol bridges, parallel-to-serial conversions, or glue logic where on-chip RAM and abundant I/Os reduce external components.
• Data Aggregation & Conditioning — Aggregate multiple sensor or channel inputs and perform buffering or pre-processing using the embedded RAM and programmable logic.
• Communications Peripherals — Support multi-interface front-ends or custom PHY control with extensive I/O and programmable logic resources.

Unique Advantages

• High logic capacity: 56,520 logic elements enable complex designs and multiple concurrent functions without frequent design partitioning.
• Substantial on-chip memory: Approximately 1.87 Mbits of embedded RAM supports buffering and local data processing, reducing reliance on external memory.
• Large I/O availability: 200 I/Os provide flexibility for interfacing many peripherals, sensors, and buses directly on-chip.
• Wide supply voltage range: 1.14 V to 2.625 V operation offers adaptability to different system power domains.
• Industrial temperature rating: −40 °C to 100 °C operation supports reliable deployment in challenging environments.
• Compact surface-mount package: 325-FCBGA (11×11) allows dense PCB integration while supporting automated assembly processes.

Why Choose M2GL060-1FCS325I?

The M2GL060-1FCS325I positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant logic resources, abundant I/O, and reliable operation across a wide temperature and supply-voltage range. Its combination of logic elements, embedded memory, and 200 I/Os makes it suited for embedded control, interface consolidation, and data conditioning tasks.

Manufactured by Microchip Technology and RoHS compliant, this IGLOO2 device is targeted at engineers and procurement teams seeking a compact, surface-mount FPGA with industrial operating limits and flexible power requirements for long-term deployment.

Request a quote or submit an inquiry for pricing and availability of the M2GL060-1FCS325I to begin integrating this FPGA into your next design.