M2GL060-1FCSG325

The M2GL060-1FCSG325 is an IGLOO2 family Field Programmable Gate Array (FPGA) IC designed for programmable logic applications. It integrates a substantial amount of reconfigurable logic and embedded memory with a 200‑pin I/O capability to support moderate-complexity, I/O‑rich designs.

With a commercial temperature rating and a low-voltage supply range, this surface-mount 325‑TFBGA/FCBGA device targets designs that require compact package integration, flexible I/O, and on-chip memory for buffering and state storage.

Key Features

• Logic Capacity — Provides 56,520 logic elements, enabling implementation of medium-complexity programmable logic functions.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O — 200 user I/O pins to support multiple parallel interfaces and signal routing in compact designs.
• Power Supply — Operates across a 1.14 V to 2.625 V supply range to accommodate various low-voltage logic domains.
• Package & Mounting — 325‑TFBGA / 325‑FCBGA (11×11) package in surface-mount format for high-density PCB layouts.
• Operating Conditions — Commercial grade operation from 0°C to 85°C suitable for standard environmental conditions.
• Compliance — RoHS compliant, supporting lead‑free assembly and regulatory needs for restricted substances.

Typical Applications

• Embedded Control and Glue Logic — Implement custom control state machines, protocol conversion, and glue logic between subsystems using available logic elements and I/O.
• Interface Bridging — Use the 200 I/O pins and on-chip RAM for buffering and bridging between parallel and serial interfaces or domain crossings.
• Data Buffering and Processing — Leverage approximately 1.87 Mbits of embedded memory for small packet buffering, FIFOs, and real-time data staging.
• OEM and Commercial Electronics — Compact 325‑ball BGA package and surface-mount format enable integration into space-constrained commercial products.

Unique Advantages

• Balanced Logic and Memory: 56,520 logic elements combined with approximately 1.87 Mbits of embedded RAM provide a strong balance for control, buffering, and moderate datapath tasks.
• Ample I/O Count: 200 user I/Os allow flexible interfacing to multiple peripherals and parallel buses without external expander chips.
• Compact BGA Packaging: 325‑TFBGA/FCBGA (11×11) surface-mount package minimizes PCB footprint while supporting dense routing.
• Flexible Voltage Support: Broad supply range (1.14 V to 2.625 V) enables integration with various low-voltage system rails.
• Commercial Temperature Rating: Qualified for 0°C to 85°C operation for mainstream commercial applications and environments.
• RoHS Compliance: Lead‑free, RoHS‑compliant construction simplifies adherence to restricted substance regulations.

Why Choose M2GL060-1FCSG325?

The M2GL060-1FCSG325 delivers a practical combination of logic capacity, embedded memory, and I/O density in a compact 325‑ball BGA package. Its voltage flexibility and commercial temperature rating make it well suited for designers building compact, I/O-intensive programmable logic solutions for commercial products.

This device is appropriate for teams seeking a mid-range FPGA resource set—offering on-chip RAM for buffering, a substantial pool of logic elements for control and glue logic, and a high I/O count to reduce external components and simplify board-level integration.

Request a quote or submit a purchase inquiry to receive pricing and availability for the M2GL060-1FCSG325. Our team can provide lead‑time and ordering details to support your design cycle.