M2GL060-1FCS325
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56520 325-TFBGA, FCBGA |
|---|---|
| Quantity | 384 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL060-1FCS325 – IGLOO2 FPGA with 56,520 Logic Elements
The M2GL060-1FCS325 is an IGLOO2 field programmable gate array (FPGA) IC offering 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 200 user I/Os. The device is supplied in a 325-pin FCBGA surface-mount package (325-TFBGA, 11×11) and operates over a commercial temperature range.
With a supply voltage window from 1.14 V to 2.625 V and RoHS compliance, this FPGA is specified for designs that require substantial on-chip logic capacity and memory while using a compact BGA footprint.
Key Features
- Core Capacity 56,520 logic elements provide the programmable fabric for implementing custom digital functions and logic-intensive designs.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines, and local data storage requirements.
- I/O Count 200 user I/Os to interface with peripherals, sensors, and external devices.
- Power Supply Supports a wide supply voltage range from 1.14 V to 2.625 V for flexible integration with various system rails.
- Package and Mounting 325-TFBGA / 325-FCBGA (11×11) surface-mount package for compact board-level integration.
- Operating Conditions Commercial grade operation with a temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant materials.
Unique Advantages
- Substantial Logic Density: 56,520 logic elements enable complex programmable functions without external logic expansion.
- On-chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
- High I/O Count: 200 I/Os simplify interfacing by providing ample pins for parallel buses, multiple peripherals, or mixed-signal front ends.
- Flexible Power Integration: Broad supply range (1.14 V–2.625 V) accommodates different system power architectures and voltage domains.
- Compact BGA Package: 325-FCBGA (11×11) surface-mount footprint enables dense board layouts while maintaining robust soldered connections.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for typical commercial and embedded applications.
Why Choose M2GL060-1FCS325?
The M2GL060-1FCS325 combines a large logic fabric, meaningful on-chip memory, and a high I/O count in a compact 325-pin BGA package. Its supply voltage flexibility and commercial temperature rating make it suitable for a wide range of embedded systems where on-board programmable logic and local memory are required.
This IGLOO2 FPGA is well suited for engineers and procurement teams looking for a RoHS-compliant, surface-mount programmable device that balances logic capacity and I/O density while fitting into space-constrained board designs.
Request a quote or submit a quote today to get pricing and availability for the M2GL060-1FCS325.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D