M2GL060-1FCS325

IC FPGA 200 I/O 325BGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56520 325-TFBGA, FCBGA

Quantity 384 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case325-TFBGA, FCBGANumber of I/O200Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56520Number of Logic Elements/Cells56520
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL060-1FCS325 – IGLOO2 FPGA with 56,520 Logic Elements

The M2GL060-1FCS325 is an IGLOO2 field programmable gate array (FPGA) IC offering 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 200 user I/Os. The device is supplied in a 325-pin FCBGA surface-mount package (325-TFBGA, 11×11) and operates over a commercial temperature range.

With a supply voltage window from 1.14 V to 2.625 V and RoHS compliance, this FPGA is specified for designs that require substantial on-chip logic capacity and memory while using a compact BGA footprint.

Key Features

  • Core Capacity 56,520 logic elements provide the programmable fabric for implementing custom digital functions and logic-intensive designs.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines, and local data storage requirements.
  • I/O Count 200 user I/Os to interface with peripherals, sensors, and external devices.
  • Power Supply Supports a wide supply voltage range from 1.14 V to 2.625 V for flexible integration with various system rails.
  • Package and Mounting 325-TFBGA / 325-FCBGA (11×11) surface-mount package for compact board-level integration.
  • Operating Conditions Commercial grade operation with a temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant materials.

Unique Advantages

  • Substantial Logic Density: 56,520 logic elements enable complex programmable functions without external logic expansion.
  • On-chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
  • High I/O Count: 200 I/Os simplify interfacing by providing ample pins for parallel buses, multiple peripherals, or mixed-signal front ends.
  • Flexible Power Integration: Broad supply range (1.14 V–2.625 V) accommodates different system power architectures and voltage domains.
  • Compact BGA Package: 325-FCBGA (11×11) surface-mount footprint enables dense board layouts while maintaining robust soldered connections.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for typical commercial and embedded applications.

Why Choose M2GL060-1FCS325?

The M2GL060-1FCS325 combines a large logic fabric, meaningful on-chip memory, and a high I/O count in a compact 325-pin BGA package. Its supply voltage flexibility and commercial temperature rating make it suitable for a wide range of embedded systems where on-board programmable logic and local memory are required.

This IGLOO2 FPGA is well suited for engineers and procurement teams looking for a RoHS-compliant, surface-mount programmable device that balances logic capacity and I/O density while fitting into space-constrained board designs.

Request a quote or submit a quote today to get pricing and availability for the M2GL060-1FCS325.

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