M2GL060TS-FGG676I

The M2GL060TS-FGG676I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology offered in a 676-ball BGA package. This industrial-grade, surface-mount FPGA provides a balance of logic capacity, on-chip memory, and a high I/O count for embedded and control-oriented designs that require reprogrammable logic and flexible I/O provisioning.

Key Features

• Logic Capacity — 56,520 logic elements for implementing custom digital functions and moderate to high-density logic designs.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM (1,869,824 total RAM bits) to support buffering, lookup tables, and small data storage needs directly on the device.
• I/O Resources — 387 user I/O pins to support broad connectivity and parallel interfaces without external glue logic.
• Power Supply Range — Operates from 1.14 V to 2.625 V, allowing flexibility in system power architectures and mixed-voltage designs.
• Package & Mounting — 676-BGA (supplier device package: 676-FBGA, 27×27) in a surface-mount form factor for high-density board layouts.
• Industrial Temperature Range — Specified for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating, plentiful I/O, and on-chip memory to implement factory automation logic, sensor interfacing, and control algorithms.
• Embedded Systems — Deploy the FPGA as application-specific logic in embedded platforms where reprogrammability and custom I/O mapping are required.
• Prototyping & Custom Interfaces — Leverage abundant I/O and logic elements to prototype interfaces, glue logic, and custom peripherals without redesigning PCBs for each iteration.

Unique Advantages

• High Logic Density: 56,520 logic elements enable implementation of complex finite-state machines, data paths, and control logic within a single device, reducing component count.
• On-Chip Memory: Approximately 1.87 Mbits of embedded RAM provides local buffering and scratchpad storage that simplifies memory architecture and improves data throughput.
• Extensive I/O: 387 I/O pins support parallel interfaces and multiple peripheral connections, minimizing the need for external expanders.
• Flexible Power Window: Broad supply voltage support (1.14 V to 2.625 V) allows integration into systems with varied voltage domains.
• Industrial Reliability: Specified operation from –40 °C to 100 °C and RoHS compliance make the part suitable for long-life industrial deployments.
• Compact, High-Density Packaging: 676-FBGA (27×27) surface-mount package supports space-constrained boards while offering extensive routing and thermal characteristics for PCB design.

Why Choose M2GL060TS-FGG676I?

The M2GL060TS-FGG676I IGLOO2 FPGA delivers a practical blend of logic capacity, embedded memory, and a high I/O count in a compact 676-BGA package targeted at industrial embedded and control applications. Its voltage flexibility and wide operating temperature range make it suitable for systems that demand reprogrammable logic along with reliable operation across varied environments.

This part is well suited to designers building medium- to high-density custom logic, prototyping complex interfaces, or consolidating discrete functions into a single programmable device to reduce overall BOM and simplify board-level design.

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