M2GL060TS-FGG676

The M2GL060TS-FGG676 is an IGLOO2 field programmable gate array from Microchip Technology. It provides a programmable fabric with 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 387 user I/O pins in a compact 676-FBGA (27×27) package.

Designed for commercial-grade applications, the device supports surface-mount assembly, operates from a 1.14 V to 2.625 V supply range, and is specified for an ambient temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Logic Capacity  56,520 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• High I/O Count  387 user I/O pins to accommodate extensive peripheral interfaces and signal routing.
• Power and Voltage  Wide supply voltage support from 1.14 V to 2.625 V for flexible power-domain integration.
• Package and Mounting  676-FBGA (27×27) package in a surface-mount form factor for high-density board designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for general commercial applications.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom Logic and Control  Implement state machines, protocol bridges, and application-specific processing using 56,520 logic elements.
• Data Buffering and Local Storage  Use approximately 1.87 Mbits of embedded RAM for FIFO buffers, packet buffering, and lookup tables.
• High-density I/O Aggregation  Aggregate multiple interfaces or sensor channels across 387 I/O pins for complex system integration.
• Compact Board Designs  Leverage the 676-FBGA (27×27) package for space-constrained PCBs requiring high logic and I/O density.

Unique Advantages

• High Logic Density:  56,520 logic elements enable sizable designs without external glue logic, reducing component count.
• Substantial On-chip Memory:  Approximately 1.87 Mbits of RAM supports local buffering and state storage, improving data throughput and latency.
• Extensive I/O Complement:  387 I/O pins provide flexibility to connect many peripherals and signals directly to the FPGA fabric.
• Flexible Power Architecture:  Support for 1.14 V to 2.625 V supplies allows integration into a variety of power-domain schemes.
• Compact, Surface-Mount Package:  676-FBGA (27×27) delivers high integration in a board-friendly surface-mount form factor.
• Commercial-grade Reliability:  Specified for 0 °C to 85 °C operation and RoHS compliant to match common manufacturing and deployment requirements.

Why Choose M2GL060TS-FGG676?

The M2GL060TS-FGG676 brings together a substantial logic element count, significant embedded RAM, and a large I/O complement in a compact 676-FBGA package, making it suitable for designs that require high integration in a commercial temperature environment. Its wide supply voltage range and surface-mount package offer flexibility for varied board-level power and layout requirements.

This device is a practical option for engineering teams targeting systems that need dense programmable logic, local memory, and broad I/O within standard commercial operating conditions, while maintaining RoHS environmental compliance.

Request a quote or submit your specifications today to get pricing and availability for the M2GL060TS-FGG676.