M2GL060TS-FG676I

The M2GL060TS-FG676I is an IGLOO2 family Field Programmable Gate Array from Microchip Technology, provided in a 676-FBGA (27×27) package. It combines a high logic element count, substantial on-chip RAM and a large I/O complement to address complex embedded logic requirements.

Designed for industrial applications, this device supports a wide supply-voltage range and extended operating temperature, making it suitable for systems that require robust operation across varied environments while integrating dense programmable logic and memory resources.

Key Features

• Logic Capacity  56,520 logic elements for implementing complex state machines, datapaths and custom logic functions.
• Embedded Memory  Approximately 1.87 Mbits of embedded memory to support buffering, on-chip data storage and local scratchpad needs.
• I/O Density  387 available I/Os to support extensive signal interfacing and multiple peripheral connections without external multiplexing.
• Power Supply Range  Flexible supply-voltage support from 1.14 V to 2.625 V to match diverse system rail architectures.
• Package & Mounting  676-FBGA (27×27) package in a surface-mount form factor for high pin-count designs in a compact footprint.
• Industrial Temperature Range  Qualified to operate from −40 °C to 100 °C to meet industrial environment requirements.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use the industrial temperature rating and robust logic capacity to implement control algorithms, state machines and real-time signal handling in factory automation equipment.
• High-Density Embedded Logic  Leverage 56,520 logic elements for complex protocol handling, custom accelerators or glue logic in embedded systems.
• Memory-Intensive Processing  Approximately 1.87 Mbits of on-chip RAM supports buffering and local data storage for streaming and packet-handling applications.
• I/O-Rich System Integration  387 I/Os enable broad sensor, actuator and peripheral interfacing without extensive external multiplexing or I/O expanders.

Unique Advantages

• High Logic Density: 56,520 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• On-Chip Memory for Local Storage: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary data storage.
• Extensive I/O: 387 I/Os simplify connectivity to a wide array of peripherals and interfaces, minimizing external interface hardware.
• Flexible Power Integration: Broad supply-voltage range (1.14 V to 2.625 V) supports integration into diverse power architectures.
• Industrial Reliability: Surface-mount 676-FBGA packaging plus −40 °C to 100 °C operating temperature supports deployment in demanding environments.
• RoHS Compliant: Meets common environmental and regulatory requirements for lead-free assemblies.

Why Choose M2GL060TS-FG676I?

The M2GL060TS-FG676I balances high logic capacity, substantial embedded memory and a large I/O count within a compact 676-FBGA package, making it a practical choice for industrial designs that need integrated programmable logic and reliable operation across extended temperatures. Its flexible supply-voltage range and RoHS compliance further ease system integration and regulatory alignment.

This device is suited to engineers building systems that require on-chip memory and extensive I/O while operating in industrial environments. It offers scalability and integration that can reduce board complexity and support long-term deployment in production systems.

Request a quote to evaluate the M2GL060TS-FG676I for your design needs or submit a quotation inquiry for pricing and availability.