M2GL060TS-FCSG325I

The M2GL060TS-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 325-TFBGA/FCBGA package. It delivers a high logic element count and substantial embedded memory capacity within a compact BGA footprint.

This industrial-grade device supports a wide operating temperature range and a broad supply-voltage window, making it suitable for designs that require programmable logic with defined environmental and power requirements.

Key Features

• Logic Capacity  Approximately 56,520 logic elements provide significant programmable logic resources for complex implementations.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Count  200 general-purpose I/O pins to support multiple interfaces and board-level connectivity.
• Power  Operates from 1.14 V to 2.625 V supply rails, enabling flexibility in system power architectures.
• Package & Mounting  Available in a 325-TFBGA/325-FCBGA (11×11) package; designed for surface-mount assembly.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic density: The device's ~56,520 logic elements enable integration of complex logic functions on a single FPGA, reducing external component count.
• Substantial on-chip memory: Approximately 1.87 Mbits of embedded RAM supports local data buffering and state storage without needing additional external memory.
• Generous I/O availability: 200 I/O pins provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA.
• Wide supply-voltage support: Operation from 1.14 V to 2.625 V accommodates a range of system power domains and design constraints.
• Industrial temperature rating: −40 °C to 100 °C operation helps ensure reliable behavior in temperature-sensitive or industrial applications.
• Compact BGA package: 325-TFBGA/FCBGA (11×11) packaging and surface-mount compatibility support space-constrained board layouts and automated assembly.

Why Choose M2GL060TS-FCSG325I?

The M2GL060TS-FCSG325I positions itself as a robust IGLOO2 FPGA option for designs that require substantial logic resources, embedded memory, and flexible I/O in an industrial-grade package. Its combination of logic capacity, on-chip RAM, and wide supply-voltage range supports integrated, compact implementations where environmental range and board-level integration matter.

This device is well suited for engineering teams seeking a programmable logic solution that balances integration and specification-driven reliability, while fitting compact BGA footprints and surface-mount manufacturing flows.

Request a quote or submit an inquiry to obtain pricing and availability for the M2GL060TS-FCSG325I.