M2GL060TS-FCS325I

The M2GL060TS-FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It delivers a large logic fabric with 56,520 logic elements and approximately 1.87 Mbits of embedded memory, combined with 200 user I/Os to support complex digital functions and broad interfacing needs.

With a wide supply range and an industrial operating temperature window, this surface-mount 325‑TFBGA device is intended for designs that require substantial on-chip logic capacity and reliable operation across demanding environmental conditions.

Key Features

• Core Capacity — 56,520 logic elements provide the programmable resources needed for sizable digital designs and custom accelerators.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines, and data storage for implemented logic.
• I/O Resources — 200 available I/Os to accommodate multiple interfaces and parallel connectivity requirements.
• Power Supply Range — Operates from 1.14 V to 2.625 V, enabling flexibility with various system power rails.
• Package & Mounting — 325‑TFBGA / 325‑FCBGA (11×11) supplier package in a surface-mount form factor for compact board integration.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet temperature demands of industrial deployments.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control Systems — Industrial-grade temperature rating and extensive I/O count make the device suitable for interfacing sensors, actuators, and control logic.
• Communication Interfaces — Large logic capacity and plentiful I/Os support implementation of protocol bridges, custom packet processing, and interface adaptation.
• Embedded Processing and Acceleration — The combination of many logic elements and on-chip RAM enables hardware acceleration and custom state-machine implementations for embedded systems.

Unique Advantages

• High Logic Density: 56,520 logic elements allow implementation of complex, multi-domain digital designs without external logic expansion.
• Substantial On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Generous I/O Count: 200 I/Os provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA fabric.
• Broad Supply Compatibility: Support for 1.14 V to 2.625 V operation accommodates a range of system power architectures.
• Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with regulatory considerations.
• Compact Surface-Mount Package: 325‑TFBGA / 325‑FCBGA (11×11) package enables dense board-level integration in space-constrained designs.

Why Choose M2GL060TS-FCS325I?

The M2GL060TS-FCS325I positions itself as a high-capacity IGLOO2 FPGA option for industrial systems that require significant programmable logic, on-chip memory, and a large number of I/Os. Its combination of logic resources, embedded RAM, and flexible supply range make it suitable for engineers designing complex digital functions where integration and environmental robustness matter.

This device is well-suited for development teams and procurement seeking an FPGA with substantial on-chip resources in a compact surface-mount 325‑TFBGA package, backed by RoHS compliance and industrial temperature operation.

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