M2GL060TS-FCS325

The M2GL060TS-FCS325 is a commercial-grade IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a high logic density device in a compact 325-TFBGA (325-FCBGA, 11×11) surface-mount package suitable for programmable logic and embedded designs.

With 56,520 logic elements, approximately 1.87 Mbits of on-chip RAM and 200 I/O, this FPGA targets applications that require substantial on-chip logic and memory integration while operating across a flexible supply range of 1.14 V to 2.625 V.

Key Features

• Core / Logic 56,520 logic elements for implementing complex programmable logic functions.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support data buffering and state storage without immediate reliance on external memory.
• I/O 200 I/O pins to accommodate a variety of external interfaces and signals.
• Power Voltage supply range from 1.14 V to 2.625 V for flexible power-domain designs.
• Package & Mounting 325-TFBGA / 325-FCBGA (11×11) package in a surface-mount form factor for compact board integration.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded Systems — Implement custom control logic, protocol handling or glue logic where integrated logic and memory reduce external components.
• Communications Equipment — Handle programmable interface logic and data-path functions that benefit from high I/O count and on-chip memory.
• Signal Processing and Acceleration — Deploy custom datapaths and buffering using the available logic elements and embedded RAM.
• Prototyping and Development Platforms — Use the device for hardware prototyping where reprogrammability and a high logic count are needed.

Unique Advantages

• High-density logic: 56,520 logic elements enable implementation of complex functions and larger designs without immediate recourse to external logic.
• Integrated on-chip memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Generous I/O count: 200 I/O pins help consolidate multiple interfaces and simplify board-level routing.
• Compact, surface-mount package: 325-TFBGA / 325-FCBGA (11×11) packaging minimizes board area for space-constrained applications.
• Flexible supply range: 1.14 V to 2.625 V operation provides design flexibility across different power schemes.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose M2GL060TS-FCS325?

The M2GL060TS-FCS325 offers a balance of high logic capacity, embedded memory and I/O density in a compact FCBGA package from Microchip Technology. It is positioned for designers who need substantial on-chip resources for programmable logic tasks while maintaining a small board footprint and flexible power options.

This device is well suited to teams building scalable embedded designs, communication interfaces, or signal-processing engines that benefit from integrated logic and RAM. Its commercial temperature rating and RoHS compliance support production deployments within the specified operating range.

Request a quote or submit a product inquiry to receive pricing and availability information for the M2GL060TS-FCS325.