M2GL060TS-FCSG325

The M2GL060TS-FCSG325 is an IGLOO2 field programmable gate array (FPGA) IC designed for configurable digital logic implementation. It delivers 56,520 logic elements and substantial on-chip memory to support complex, custom logic functions in commercial electronic designs.

With 200 user I/O pins, a compact 325-FCBGA (11×11) package option, and a broad supply voltage range, this device targets applications that require high logic density, flexible I/O, and a compact surface-mount footprint within a commercial temperature range.

Key Features

• Logic Resources  56,520 logic elements for implementing substantial custom digital logic and control functions.
• On-Chip Memory  Approximately 1.87 Mbits of embedded memory (1,869,824 total RAM bits) to support data buffering, state machines, and local storage.
• I/O Capacity  200 I/O pins to interface with sensors, peripherals, and external logic, enabling broad connectivity options.
• Power Supply Range  Operates across a supply voltage range of 1.14 V to 2.625 V to accommodate different core and I/O power configurations.
• Package & Mounting  Available in a 325-TFBGA / 325-FCBGA package (supplier device package: 325-FCBGA, 11×11); surface-mount mounting for compact board-level integration.
• Commercial Grade Temperature  Rated for operation from 0°C to 85°C, suitable for standard commercial-environment applications.
• RoHS Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate complex digital designs using 56,520 logic elements and approximately 1.87 Mbits of embedded memory.
• I/O-heavy control systems — Use the 200 I/O pins to connect a variety of peripherals, sensors, and external devices in compact embedded systems.
• Compact board-level integration — The 325-FCBGA (11×11) surface-mount package supports dense PCB layouts where board space is limited.

Unique Advantages

• High logic density: 56,520 logic elements enable implementation of large or multiple concurrent logic functions without external CPLDs or glue logic.
• Generous embedded memory: Approximately 1.87 Mbits of on-chip RAM reduces dependence on external memory for buffering and local storage.
• Robust I/O count: 200 user I/O pins provide the flexibility to connect numerous peripherals and interfaces directly to the FPGA.
• Flexible power options: A supply range from 1.14 V to 2.625 V supports a variety of power architectures and I/O standards within system constraints.
• Compact packaging: 325-FCBGA (11×11) surface-mount package enables high-density PCB designs and compact system layouts.
• Commercial temperature rating: Operates from 0°C to 85°C, aligning with typical commercial deployment requirements.

Why Choose M2GL060TS-FCSG325?

The M2GL060TS-FCSG325 combines substantial programmable logic resources with ample embedded memory and a high I/O count in a compact surface-mount BGA package. Its supply voltage flexibility and RoHS compliance make it suitable for commercial electronic designs that require a balance of integration density and configurable functionality.

This device is well suited to engineers and procurement teams developing board-level systems that need significant on-chip logic and memory, a high number of I/Os, and a commercial operating temperature range. Its package options and surface-mount mounting support compact, manufacturable designs.

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