M2GL060TS-FG676

IC FPGA 387 I/O 676FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 387 1869824 56520 676-BGA

Quantity 624 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O387Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56520Number of Logic Elements/Cells56520
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL060TS-FG676 – IGLOO2 Field Programmable Gate Array (FPGA), 676-BGA

The M2GL060TS-FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 56,520 logic elements and approximately 1.87 Mbits of embedded memory in a surface-mount 676-BGA package.

Targeted for commercial-grade electronic designs, the device provides 387 I/O, a supply voltage range of 1.14 V to 2.625 V, and an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Logic Capacity 56,520 logic elements to implement custom programmable logic and control functions.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM (1,869,824 bits) for buffering, state storage, and local data processing.
  • I/O Resources 387 I/O pins to support a wide range of peripheral interfaces and signal connections.
  • Power Wide supply range from 1.14 V to 2.625 V to accommodate different system voltage domains.
  • Package & Mounting Surface-mount 676-BGA package; supplier device package listed as 676-FBGA (27x27).
  • Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operation.
  • Compliance RoHS compliant.

Unique Advantages

  • High logic density: 56,520 logic elements provide substantial programmable resources within a single device.
  • Significant embedded memory: Approximately 1.87 Mbits of on-chip RAM supports local buffering and data handling without adding external memory.
  • Generous I/O count: 387 I/O pins enable broad connectivity to peripherals, sensors, and interfaces.
  • Flexible power options: Support for 1.14 V to 2.625 V supply voltages allows integration into varied power architectures.
  • Compact surface-mount package: 676-BGA / 676-FBGA (27x27) package consolidates capability into a compact board footprint.
  • Commercial temperature rating: Designed for standard commercial environments (0 °C to 85 °C).

Why Choose M2GL060TS-FG676?

The M2GL060TS-FG676 balances significant programmable logic capacity, on-chip memory, and a high I/O count in a compact 676-BGA surface-mount package. Its supply voltage flexibility and commercial temperature grade make it suitable for a range of board-level designs that require dense programmable logic and local memory.

Choose this IGLOO2 FPGA when you need a single-device solution that consolidates logic resources, embedded RAM, and extensive I/O while maintaining RoHS compliance and a commercial operating profile.

Request a quote or submit an inquiry to obtain pricing and availability for the M2GL060TS-FG676.

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