M2GL090TS-1FG676

IC FPGA 425 I/O 676FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86184 676-BGA

Quantity 633 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O425Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86184
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090TS-1FG676 – IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86184 676-BGA

The M2GL090TS-1FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It combines a high logic capacity with embedded memory and a dense I/O count in a 676-ball fine-pitch BGA package, offering a compact, surface-mount FPGA solution for commercial designs.

Key device attributes include 86,184 logic elements, approximately 2.65 Mbits of embedded memory, and 425 I/O, with an operating voltage range from 1.14 V to 2.625 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic 86,184 logic elements provide substantial programmable logic capacity for complex glue logic, state machines, and custom datapaths.
  • Embedded Memory Approximately 2.65 Mbits of on-chip RAM for buffering, FIFOs, and small memory-mapped structures without external memory.
  • I/O Density 425 I/O pins allow high pin-count interfacing for multi-channel I/O, parallel buses, and mixed-signal front-ends.
  • Power and Voltage Flexibility Supports supply voltages from 1.14 V to 2.625 V to accommodate a range of core and I/O voltage domains.
  • Package & Mounting 676-ball FBGA (27 × 27 mm) package in a surface-mount form factor for compact board-level integration.
  • Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
  • RoHS Compliance RoHS-compliant construction supports regulatory and supply-chain requirements for restricted substances.

Unique Advantages

  • High logic capacity: 86,184 logic elements enable integration of substantial FPGA functionality on a single device, reducing the need for multiple components.
  • On-chip memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
  • Extensive I/O: 425 I/O pins support dense peripheral and sensor interfaces, simplifying board routing for multi-channel designs.
  • Compact BGA package: 676-FBGA (27 × 27 mm) provides a high-density solution for space-constrained PCBs while maintaining robust connectivity.
  • Flexible voltage support: Broad supply range (1.14 V to 2.625 V) allows deployment across different logic and I/O voltage domains.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications and environments.

Why Choose M2GL090TS-1FG676?

The M2GL090TS-1FG676 balances substantial programmable logic, on-chip memory, and a high I/O count within a compact 676-FBGA package, making it suitable for commercial electronic designs that require dense integration and flexible interfacing. Its voltage range and surface-mount form factor support varied board-level architectures while RoHS compliance aligns with common environmental requirements.

This FPGA is appropriate for design teams seeking to consolidate logic and memory resources on a single device to reduce BOM complexity, simplify board layout, and accelerate prototyping and deployment cycles.

Request a quote or submit an inquiry for the M2GL090TS-1FG676 to receive pricing and availability information tailored to your project requirements.

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