M2GL090TS-1FGG484I

The M2GL090TS-1FGG484I is an IGLOO2 Field Programmable Gate Array (FPGA) IC by Microchip Technology. It delivers a high-density programmable logic fabric combined with embedded RAM and a large I/O count in a compact 484-BGA package for space-constrained, industrial designs.

With 86,316 logic elements and approximately 2.65 Mbits of on-chip RAM, this device targets applications that require substantial configurable logic, plentiful I/O, and operation across an industrial temperature range.

Key Features

• Logic Capacity — 86,316 logic elements provide significant programmable logic resources for custom digital functions and hardware acceleration.
• Embedded Memory — Approximately 2.65 Mbits of total on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources — 267 I/O pins to support multiple interfaces, parallel buses, and high-pin-count system integration.
• Power Supply Range — Operates from 1.14 V to 2.625 V, enabling flexibility with system power rails.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package and Mounting — 484-ball FPBGA (23 × 23 mm) package, surface-mount mounting for compact board layouts.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Custom Digital Logic — Implement application-specific datapaths, protocol handling, and hardware accelerators using available logic and memory.
• I/O-Intensive Systems — Aggregate and bridge multiple interfaces or parallel buses using a high pin-count I/O set.
• Industrial Embedded Systems — Deploy in systems requiring industrial temperature operation and durable surface-mount packaging.

Unique Advantages

• High Logic Density: 86,316 logic elements allow integration of complex logic functions on a single device, reducing external components.
• Substantial On-Chip RAM: Approximately 2.65 Mbits of embedded memory supports local buffering and state storage without external RAM.
• Extensive I/O Count: 267 I/Os simplify system-level connectivity and reduce the need for external multiplexing or expanders.
• Industrial Temperature Rating: −40 °C to 100 °C operation extends suitability to harsher environments and industrial deployments.
• Compact BGA Packaging: 484-ball FPBGA (23 × 23 mm) enables a small PCB footprint while providing high-pin density.
• Flexible Power Support: Wide supply range (1.14 V–2.625 V) accommodates diverse power-rail architectures.

Why Choose M2GL090TS-1FGG484I?

The M2GL090TS-1FGG484I combines a high count of logic elements, multi-megabit embedded RAM, and a large I/O set in a compact 484-BGA footprint, positioned to simplify integration of complex digital functions in industrial-grade designs. Its wide supply range and industrial temperature capability make it a fit for systems that require both configurability and robust environmental performance.

This part is well suited for designers seeking to consolidate discrete logic, memory, and interfacing into a single programmable device, enabling reduced bill of materials and streamlined board layouts while maintaining durable operation across demanding temperature conditions.

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