M2GL090TS-1FGG676I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA |
|---|---|
| Quantity | 316 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 425 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86316 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090TS-1FGG676I – IGLOO2 Field Programmable Gate Array (FPGA) IC 425 2648064 86316 676-BGA
The M2GL090TS-1FGG676I is an IGLOO2 field programmable gate array from Microchip Technology, offered as a surface-mount 676-BGA device. It combines a high count of logic elements and on-chip RAM with a large number of I/O pins to support complex programmable logic designs.
Designed for industrial use, this device operates across a wide supply voltage range and extended temperature window, making it suitable for systems that require dense logic, substantial embedded memory, and robust I/O connectivity.
Key Features
- Logic Capacity — Provides 86,316 logic elements (cells) for implementing complex digital functions and custom logic blocks.
- Embedded Memory — Approximately 2.65 Mbits of total on-chip RAM to support buffering, FIFOs, and distributed memory needs within the FPGA fabric.
- I/O Resources — 425 I/O pins to interface with multiple peripherals, high-pin-count connectors, and parallel buses.
- Power Range — Supports a wide supply voltage range from 1.14 V to 2.625 V to accommodate varying power architectures.
- Package and Mounting — 676-ball BGA in a 27 × 27 format (676-FBGA) for high-density board layouts; surface-mount package simplifies PCB assembly.
- Industrial Grade & Temperature — Industrial-grade device rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
- Regulatory — RoHS-compliant for environmental and manufacturing compliance.
Typical Applications
- Industrial Control — High logic capacity and extensive I/O make this FPGA suitable for motor control, PLC offloading, and complex automation tasks requiring rugged operation.
- Communications Equipment — Large embedded memory and abundant I/O enable packet buffering, protocol bridging, and custom interface logic in networking and telecom equipment.
- Data Acquisition & Signal Processing — On-chip RAM and dense logic support real-time buffering and preprocessing of sensor data in measurement and instrument systems.
- Embedded System Integration — Use as a configurable glue logic and peripheral aggregator for systems that require custom timing, wide I/O fanout, or protocol conversion.
Unique Advantages
- High Integration: Combines tens of thousands of logic elements with multiple megabits of embedded RAM to reduce external components and simplify system design.
- Large I/O Count: 425 I/O pins enable direct connections to numerous peripherals, reducing the need for external multiplexers or expanders.
- Flexible Power Options: Wide supply voltage range accommodates varied power domains and board-level power management strategies.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust BGA package for reliable performance in demanding environments.
- RoHS-Compliant: Meets environmental manufacturing requirements to support regulatory and sourcing needs.
Why Choose M2GL090TS-1FGG676I?
The M2GL090TS-1FGG676I positions itself as a high-capacity IGLOO2 FPGA option for systems that demand substantial logic resources, embedded memory, and a large number of I/O connections in an industrial-grade package. Its combination of logic elements, approximately 2.65 Mbits of on-chip RAM, and 425 I/O pins makes it well suited for complex embedded designs that require consolidation of functions and deterministic hardware performance.
Engineers and procurement teams targeting scalable, robust FPGA solutions will find this device appropriate for applications across industrial automation, communications, data acquisition, and embedded system integration, offering long-term design flexibility and compliance with RoHS requirements.
Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the M2GL090TS-1FGG676I.

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