M2GL090TS-FCS325

The M2GL090TS-FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivered in a 325‑TFBGA (11×11) surface-mount package. This commercial‑grade FPGA provides high logic density and embedded memory in a compact, low‑power footprint for board‑level digital designs.

With 86,184 logic elements, approximately 2.65 Mbits of embedded RAM, and 180 I/O pins, the device is suited to designs that require substantial on‑chip logic and memory resources while operating across a 1.14 V to 2.625 V supply range and a 0 °C to 85 °C operating temperature.

Key Features

• Core Logic 86,184 logic elements provide a large fabric for implementing custom digital logic and complex state machines.
• On‑chip Memory Approximately 2.65 Mbits of embedded memory supports buffering, local storage, and data manipulation without external RAM.
• I/O Density 180 general-purpose I/O pins enable broad peripheral interfacing and board connectivity for mixed-signal and digital systems.
• Power and Voltage Flexibility Supports a supply range from 1.14 V to 2.625 V to accommodate various core and I/O voltage schemes.
• Package & Mounting 325‑TFBGA (FCBGA) package, supplier device package 325‑FCBGA (11×11), designed for surface-mount assembly on compact PCBs.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for markets and designs requiring lead-free assembly.

Typical Applications

• Custom Digital Logic and Prototyping Use the FPGA fabric and abundant logic elements to implement custom state machines, accelerators, and prototype systems on a single device.
• Embedded Memory‑Centric Designs Designs that require on‑chip buffering, FIFO implementations, or localized lookup tables can leverage approximately 2.65 Mbits of embedded RAM.
• High‑Pin‑Count Board Solutions With 180 I/O pins and a compact 325‑TFBGA package, the part fits dense board layouts where multiple interfaces and peripherals are needed.

Unique Advantages

• High Logic Density: 86,184 logic elements provide capacity for complex functions and integration of multiple subsystems into one device, reducing external components.
• Substantial On‑Chip RAM: Approximately 2.65 Mbits of embedded memory lowers dependence on external memory, improving performance and simplifying board routing.
• Versatile I/O Count: 180 I/O pins allow flexible interfacing options for sensors, peripherals, and system buses without needing multiple devices.
• Compact Surface‑Mount Package: 325‑TFBGA (11×11) enables dense PCB integration and small form-factor designs while supporting standard surface-mount assembly.
• Wide Supply Range: Support for 1.14 V to 2.625 V supplies offers adaptability to different core and I/O voltage domains.
• Commercial Temperature Rating: 0 °C to 85 °C operation suits a broad range of commercial and consumer applications.

Why Choose M2GL090TS-FCS325?

The M2GL090TS-FCS325 IGLOO2 FPGA combines a high count of logic elements, substantial embedded memory, and a large I/O complement in a compact 325‑TFBGA surface‑mount package. Its electrical and thermal specifications make it well suited to commercial embedded systems that require integrated digital logic, on‑chip storage, and flexible interfacing while maintaining a small board footprint.

Designers seeking scalability and reduced BOM can leverage the device’s integration to consolidate functions into a single FPGA. The combination of logic density, embedded RAM, and I/O capability offers a platform for mid‑to‑high complexity designs where on‑board integration and compact packaging matter.

Request a quote or submit a product inquiry to receive pricing and availability information for the M2GL090TS-FCS325.