M2GL090TS-FCSG325

The M2GL090TS-FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides reconfigurable logic resources and embedded memory in a compact 325-ball TFBGA/FCBGA package for commercial-grade electronic designs.

With 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM and support for up to 180 I/O pins, this device targets designs that require significant on-chip logic and memory capacity in a surface-mount BGA footprint.

Key Features

• Core Logic 86,184 logic elements (LEs) to implement complex digital functions and custom logic blocks.
• Embedded Memory Approximately 2.65 Mbits of total RAM bits (2,648,064 bits) for data buffering, packet storage, and lookup tables.
• I/O Count 180 general-purpose I/O pins, enabling multiple parallel interfaces and board-level connectivity.
• Power Supply Range Operates from 1.14 V to 2.625 V, supporting a range of core and I/O voltage configurations.
• Package & Mounting 325-ball TFBGA / FCBGA (11 × 11 mm) package; surface-mount mounting for compact PCB integration.
• Operating Conditions Commercial-grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded Systems — Reconfigurable logic and on-chip memory support custom processing, control, and interface tasks in embedded designs.
• Interface Bridging — 180 I/Os allow implementation of multiple parallel and serial interfaces on a single device.
• Prototyping and Development — High logic element count and embedded RAM enable hardware prototyping and algorithm acceleration.

Unique Advantages

• High Logic Density: 86,184 logic elements provide the capacity to implement complex custom logic and state machines on-chip.
• Substantial On-Chip Memory: Approximately 2.65 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Ample I/O Resources: 180 I/Os permit multiple concurrent interfaces and flexible board-level connectivity.
• Compact BGA Package: 325-TFBGA/FCBGA (11×11) enables high-density PCB layouts while maintaining surface-mount assembly.
• Wide Supply Flexibility: Supports core and I/O configurations with a 1.14 V to 2.625 V supply range.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation for mainstream electronic products.

Why Choose M2GL090TS-FCSG325?

The M2GL090TS-FCSG325 delivers a balanced combination of logic capacity, embedded memory, and I/O count in a compact surface-mount BGA package from Microchip Technology. It is well suited for commercial designs that require reconfigurable logic, significant on-chip RAM, and flexible connectivity while maintaining a small PCB footprint.

Choose this IGLOO2 FPGA when your design needs a high number of logic elements and memory resources in a 325-ball package, backed by RoHS compliance and commercial temperature grading.

Request a quote or submit an inquiry to discuss pricing and availability for the M2GL090TS-FCSG325.