M2GL090TS-FG676

The M2GL090TS-FG676 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology. It provides a programmable logic resource with a high logic element count and significant on-chip RAM, packaged in a 676-ball BGA.

Designed for applications that require substantial configurable logic, on‑chip memory and a high I/O count within a surface-mount 676-FBGA (27×27) package, this device targets commercial-grade embedded designs operating between 0 °C and 85 °C.

Key Features

• Logic Capacity — 86,184 logic elements to implement complex programmable logic and custom functions.
• Embedded Memory — Approximately 2.65 Mbits of on-chip RAM (2,648,064 total RAM bits) for buffering, state storage and memory-intensive logic.
• I/O Count — 425 user I/O pins to support extensive peripheral and interface connectivity.
• Power Supply — Operates from 1.14 V to 2.625 V, allowing flexibility for a range of system supply architectures.
• Package and Mounting — 676-FBGA (27×27) package case in a surface-mount form factor for high-density board integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Embedded Systems — Implement custom logic, control functions and protocol handling within compact embedded designs using the device’s large logic and memory resources.
• Custom I/O Interfaces — Leverage 425 I/O pins to aggregate, translate or bridge multiple peripheral and sensor interfaces on a single device.
• Prototyping and Development — Use the programmable logic and substantial on-chip RAM to validate and iterate hardware-accelerated functions and system architectures.
• High-density Board Designs — The 676-FBGA (27×27) surface-mount package enables dense placement of configurable logic in space-constrained PCBs.

Unique Advantages

• Large logic fabric: 86,184 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing board-level component count.
• Significant on-chip memory: Approximately 2.65 Mbits of embedded RAM supports buffering, lookup tables and state retention without external memory.
• High I/O density: 425 I/O pins enable broad connectivity options for multi-sensor, multi-channel and mixed-signal front-end designs.
• Flexible supply range: 1.14 V to 2.625 V operation accommodates different system power architectures and integration scenarios.
• Space-efficient packaging: 676-FBGA (27×27) surface-mount package supports compact, high-density PCB layouts.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose M2GL090TS-FG676?

The M2GL090TS-FG676 offers a balanced combination of large programmable logic capacity, substantial embedded memory and high I/O count in a compact 676-FBGA package, making it well suited to commercial embedded designs that require on‑board configurability and integration. Backed by Microchip Technology, this IGLOO2 FPGA provides a scalable platform for consolidating multiple functions into a single device while meeting RoHS requirements.

Choose this device when your design requires extensive programmable logic and memory resources alongside a high density of I/O in a surface-mount, commercial-grade FPGA solution.

Request a quote or submit an inquiry to obtain pricing and availability for the M2GL090TS-FG676.