M2GL090TS-FGG484I

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86184 484-BGA

Quantity 1,259 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs86184Number of Logic Elements/Cells86184
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2648064

Overview of M2GL090TS-FGG484I – IGLOO2 FPGA, 86,184 Logic Elements, 267 I/Os, 484-BGA

The M2GL090TS-FGG484I is an IGLOO2 field programmable gate array (FPGA) IC designed for industrial-grade embedded logic applications. It integrates 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and 267 general-purpose I/Os in a 484-BGA package, providing a compact platform for dense programmable logic and memory integration.

With a wide supply voltage range and an extended operating temperature window, this device supports designs that require flexible power options and reliable operation across industrial temperature conditions.

Key Features

  • Logic Capacity — 86,184 logic elements for implementing complex programmable logic and custom silicon functions.
  • Embedded Memory — Total on-chip RAM of 2,648,064 bits, approximately 2.65 Mbits of embedded memory for buffering, state storage, and local data processing.
  • I/O Count — 267 I/Os to support a broad variety of external interfaces and parallel connectivity needs.
  • Power Supply — Flexible supply voltage range from 1.14 V to 2.625 V to accommodate multiple logic and I/O voltage domains.
  • Package — 484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for high-density PCB integration.
  • Temperature Rating — Industrial operating range of −40°C to 100°C for deployment in temperature-challenging environments.
  • Compliance — RoHS compliant.

Unique Advantages

  • High integration density: Large logic element count and embedded RAM reduce the need for external components and simplify board-level integration.
  • Extensive I/O availability: 267 I/Os enable flexible connectivity to sensors, peripherals, and parallel interfaces without additional multiplexing hardware.
  • Flexible power options: Broad supply voltage range supports mixed-voltage system design and compatibility with a variety of power rails.
  • Industrial robustness: Rated for −40°C to 100°C operation to support industrial applications requiring extended temperature tolerance.
  • Compact BGA footprint: 484-BGA (23×23) surface-mount package offers a space-efficient solution for high-density PCB layouts.
  • Regulatory alignment: RoHS compliance supports environmentally conscious design and manufacturing requirements.

Why Choose M2GL090TS-FGG484I?

The M2GL090TS-FGG484I positions itself as a high-capacity IGLOO2 FPGA option for industrial designs that need a combination of abundant logic resources, on-chip memory, and a large I/O complement in a compact BGA package. Its flexible supply voltage range and industrial temperature rating make it suitable for embedded applications where reliable operation and integration density are priorities.

Engineers and procurement teams can select this device when a design requires substantial programmable logic, local RAM, and broad connectivity while maintaining a space-efficient board footprint and RoHS-compliant manufacturing readiness.

Request a quote or submit an inquiry to evaluate M2GL090TS-FGG484I for your next design or production program.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up