M2GL090TS-FGG484I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 2648064 86184 484-BGA |
|---|---|
| Quantity | 1,259 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 86184 | Number of Logic Elements/Cells | 86184 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2648064 |
Overview of M2GL090TS-FGG484I – IGLOO2 FPGA, 86,184 Logic Elements, 267 I/Os, 484-BGA
The M2GL090TS-FGG484I is an IGLOO2 field programmable gate array (FPGA) IC designed for industrial-grade embedded logic applications. It integrates 86,184 logic elements, approximately 2.65 Mbits of on-chip RAM, and 267 general-purpose I/Os in a 484-BGA package, providing a compact platform for dense programmable logic and memory integration.
With a wide supply voltage range and an extended operating temperature window, this device supports designs that require flexible power options and reliable operation across industrial temperature conditions.
Key Features
- Logic Capacity — 86,184 logic elements for implementing complex programmable logic and custom silicon functions.
- Embedded Memory — Total on-chip RAM of 2,648,064 bits, approximately 2.65 Mbits of embedded memory for buffering, state storage, and local data processing.
- I/O Count — 267 I/Os to support a broad variety of external interfaces and parallel connectivity needs.
- Power Supply — Flexible supply voltage range from 1.14 V to 2.625 V to accommodate multiple logic and I/O voltage domains.
- Package — 484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for high-density PCB integration.
- Temperature Rating — Industrial operating range of −40°C to 100°C for deployment in temperature-challenging environments.
- Compliance — RoHS compliant.
Unique Advantages
- High integration density: Large logic element count and embedded RAM reduce the need for external components and simplify board-level integration.
- Extensive I/O availability: 267 I/Os enable flexible connectivity to sensors, peripherals, and parallel interfaces without additional multiplexing hardware.
- Flexible power options: Broad supply voltage range supports mixed-voltage system design and compatibility with a variety of power rails.
- Industrial robustness: Rated for −40°C to 100°C operation to support industrial applications requiring extended temperature tolerance.
- Compact BGA footprint: 484-BGA (23×23) surface-mount package offers a space-efficient solution for high-density PCB layouts.
- Regulatory alignment: RoHS compliance supports environmentally conscious design and manufacturing requirements.
Why Choose M2GL090TS-FGG484I?
The M2GL090TS-FGG484I positions itself as a high-capacity IGLOO2 FPGA option for industrial designs that need a combination of abundant logic resources, on-chip memory, and a large I/O complement in a compact BGA package. Its flexible supply voltage range and industrial temperature rating make it suitable for embedded applications where reliable operation and integration density are priorities.
Engineers and procurement teams can select this device when a design requires substantial programmable logic, local RAM, and broad connectivity while maintaining a space-efficient board footprint and RoHS-compliant manufacturing readiness.
Request a quote or submit an inquiry to evaluate M2GL090TS-FGG484I for your next design or production program.

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