M2GL150-1FC1152

The M2GL150-1FC1152 is an IGLOO2 field programmable gate array (FPGA) IC designed for commercial applications that require high logic density and extensive I/O. Built with a large logic fabric and embedded memory, it supports complex digital implementations while offering a compact 1152-FCBGA package for surface-mount board integration.

Key Features

• Logic Capacity  146,124 logic elements provide substantial programmable resources for complex logic and control functions.
• Embedded Memory  Approximately 5.12 Mbits of on-chip RAM to support data buffering, state storage, and mid-sized memory needs.
• I/O Resources  Up to 574 I/O pins to handle dense peripheral interfacing and multi-channel connectivity requirements.
• Power Supply Range  Flexible voltage support from 1.14 V to 2.625 V to accommodate a range of system power architectures.
• Package & Mounting  1152-FCBGA (35×35 mm) ball grid array in a surface-mount form factor for compact board designs.
• Operating Range  Commercial temperature grade: 0 °C to 85 °C for standard commercial deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Designs that require extensive programmable logic capacity can leverage the 146,124 logic elements for complex state machines and data paths.
• I/O-intensive systems  Applications needing large numbers of external interfaces benefit from the device's 574 I/O pins for parallel sensors, buses, and peripheral connectivity.
• Embedded memory-dependent functions  Tasks that require on-chip buffering or local data storage can use the device's approximately 5.12 Mbits of embedded RAM.
• Compact board-level integration  Surface-mount 1152-FCBGA packaging supports space-constrained, high-density PCB layouts.

Unique Advantages

• High integration density: The combination of 146,124 logic elements and substantial on-chip RAM reduces the need for external logic and memory components.
• Extensive I/O availability: 574 I/O pins enable versatile interfacing with multiple peripherals and subsystems without complex multiplexing.
• Flexible power options: Wide supply range (1.14 V–2.625 V) allows deployment in a variety of system power architectures.
• Compact FCBGA package: 1152-FCBGA (35×35) supports high-density PCB implementations while maintaining surface-mount assembly compatibility.
• Commercial grade and compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lines.

Why Choose M2GL150-1FC1152?

The M2GL150-1FC1152 positions itself as a high-capacity IGLOO2 FPGA option for designers who need a balance of large programmable logic resources, significant embedded memory, and abundant I/O in a compact surface-mount package. Its broad supply voltage window and commercial temperature rating make it suitable for a wide range of standard embedded systems.

For teams developing designs that require on-chip compute and buffering without expanding board-level component count, this device offers a scalable platform with verifiable specifications to match integration and performance needs.

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