M2GL150-1FCG1152
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,095 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 574 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5120000 |
Overview of M2GL150-1FCG1152 – IGLOO2 Field Programmable Gate Array (FPGA), 146,124 logic elements
The M2GL150-1FCG1152 is an IGLOO2 series Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded applications that require high logic capacity, substantial on-chip memory, and a large I/O complement. Its combination of 146,124 logic elements, approximately 5.12 Mbits of embedded memory, and 574 I/Os delivers a platform for complex custom digital designs and dense interface aggregation.
Key Features
- Core Logic 146,124 logic elements provide significant programmable logic resources for implementing complex state machines, datapaths, and custom processing blocks.
- Embedded Memory Approximately 5.12 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many designs.
- I/O Capacity 574 user I/Os enable wide parallel connectivity and support for multiple high-pin-count interfaces and peripherals.
- Power Supply Range Operates across a 1.14 V to 2.625 V supply range, allowing flexibility across different power domains and system architectures.
- Package & Mounting Delivered in a 1152-FCBGA (35×35) surface-mount package, providing a compact, high-density solution for space-constrained PCBs.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for deployment in commercial-grade equipment.
- RoHS Compliant Meets RoHS environmental requirements for reduced hazardous substances.
Typical Applications
- Commercial Embedded Systems Use the FPGA to implement custom control logic, protocol handling, and feature acceleration in commercial equipment.
- Interface Aggregation Large I/O count supports consolidation of multiple interfaces and signal routing in gateway and bridging applications.
- Data Buffering & Processing On-chip memory and abundant logic enable local buffering, packet handling, and preprocessing in real-time data paths.
Unique Advantages
- High Logic Density: 146,124 logic elements allow integration of large custom designs on a single device, reducing system complexity.
- Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM minimizes dependence on external memory for many applications.
- Extensive I/O Resources: 574 I/Os provide flexibility to connect multiple peripherals and interfaces without external multiplexing.
- Flexible Power Envelope: 1.14 V to 2.625 V supply range supports diverse board-level power architectures and assists in partitioning power domains.
- Compact High-Density Package: 1152-FCBGA (35×35) packaging delivers a space-efficient solution for high-pin-count FPGA implementations.
- Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for use in commercial electronic products.
Why Choose M2GL150-1FCG1152?
The M2GL150-1FCG1152 balances large programmable logic capacity, significant embedded memory, and a very high I/O count in a compact FCBGA package. It is positioned for engineers working on commercial embedded systems that need integrated custom logic, on-chip buffering, and broad connectivity while maintaining compact board footprint and compliance with RoHS requirements.
From Microchip Technology, this IGLOO2 FPGA provides a scalable platform for mid- to high-complexity designs where integration and I/O density reduce BOM and simplify system architecture. Its electrical and thermal ratings support deployment across a range of commercial applications.
Request a quote or contact sales to discuss availability, lead times, and pricing for the M2GL150-1FCG1152.

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