M2GL150-1FCS536I

IC FPGA 293 I/O 536CSPBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 293 5120000 146124 536-LFBGA, CSPBGA

Quantity 563 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package536-CSPBGA (16x16)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case536-LFBGA, CSPBGANumber of I/O293Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs146124Number of Logic Elements/Cells146124
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5120000

Overview of M2GL150-1FCS536I – IGLOO2 FPGA, 146,124 logic elements, approximately 5.12 Mbits RAM, 293 I/O

The M2GL150-1FCS536I is an IGLOO2 Field Programmable Gate Array (FPGA) offered in high-density BGA packages. It delivers a large logic fabric and embedded memory with extensive I/O capability for designs that require significant on-chip resources and connectivity.

Targeted toward industrial applications, this device combines a wide operating voltage range and an extended operating temperature to support demanding environmental requirements while enabling flexible system integration.

Key Features

  • Logic Capacity  Provides 146,124 logic elements for complex digital designs and extensive programmable logic implementation.
  • Embedded Memory  Approximately 5.12 Mbits of on-chip RAM to support buffering, state storage, and data-processing tasks without external memory.
  • I/O Resources  293 I/O pins to accommodate multiple interfaces, sensors, and peripherals directly at the FPGA boundary.
  • Power and Voltage  Operates across a 1.14 V to 2.625 V supply range to support varied power-rail architectures and low-voltage system designs.
  • Package and Mounting  Available in 536-LFBGA and 536-CSPBGA formats; supplier package specified as 536-CSPBGA (16×16). Surface-mount construction for PCB-level integration.
  • Temperature and Grade  Industrial-grade device with an operating temperature range of -40°C to 100°C for extended-environment applications.
  • Compliance  RoHS compliant for reduced-hazard environmental requirements.

Typical Applications

  • Industrial Automation  Industrial-grade rating and -40°C to 100°C operation make the device suitable where extended-temperature reliability and many I/Os are needed for sensors and actuators.
  • Embedded Systems  High logic count and approximately 5.12 Mbits of embedded memory allow integration of complex control and processing functions on a single FPGA.
  • Communications and Networking  Large I/O count supports multiple interfaces and signal routing for networking line cards or protocol processing modules.

Unique Advantages

  • High Logic Density: 146,124 logic elements enable implementation of large logic designs without needing multiple devices, reducing board-level complexity.
  • Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduce reliance on external memory for buffering and real-time data handling.
  • Broad I/O Count: 293 I/Os provide flexibility for connecting numerous peripherals, sensors, and external interfaces directly to the FPGA.
  • Wide Voltage Compatibility: 1.14 V to 2.625 V operation supports integration with a variety of system power architectures.
  • Robust Environmental Range: Industrial grade and -40°C to 100°C operation support deployment in harsh or varied-temperature environments.
  • Compact BGA Packaging: 536-pin LFBGA and CSPBGA packages allow high-density PCB designs while maintaining surface-mount assembly.

Why Choose M2GL150-1FCS536I?

The M2GL150-1FCS536I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a combination of large logic resources, significant embedded memory, and abundant I/O. Its voltage flexibility and BGA packaging make it suitable for compact, high-density systems that must operate across extended temperature ranges.

This device is appropriate for engineering teams designing complex embedded systems, industrial control platforms, or communications modules that benefit from on-chip memory and extensive I/O while meeting RoHS and industrial-environment requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the M2GL150-1FCS536I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up