M2GL150-1FCS536I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 293 5120000 146124 536-LFBGA, CSPBGA |
|---|---|
| Quantity | 563 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 536-CSPBGA (16x16) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 536-LFBGA, CSPBGA | Number of I/O | 293 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5120000 |
Overview of M2GL150-1FCS536I – IGLOO2 FPGA, 146,124 logic elements, approximately 5.12 Mbits RAM, 293 I/O
The M2GL150-1FCS536I is an IGLOO2 Field Programmable Gate Array (FPGA) offered in high-density BGA packages. It delivers a large logic fabric and embedded memory with extensive I/O capability for designs that require significant on-chip resources and connectivity.
Targeted toward industrial applications, this device combines a wide operating voltage range and an extended operating temperature to support demanding environmental requirements while enabling flexible system integration.
Key Features
- Logic Capacity Provides 146,124 logic elements for complex digital designs and extensive programmable logic implementation.
- Embedded Memory Approximately 5.12 Mbits of on-chip RAM to support buffering, state storage, and data-processing tasks without external memory.
- I/O Resources 293 I/O pins to accommodate multiple interfaces, sensors, and peripherals directly at the FPGA boundary.
- Power and Voltage Operates across a 1.14 V to 2.625 V supply range to support varied power-rail architectures and low-voltage system designs.
- Package and Mounting Available in 536-LFBGA and 536-CSPBGA formats; supplier package specified as 536-CSPBGA (16×16). Surface-mount construction for PCB-level integration.
- Temperature and Grade Industrial-grade device with an operating temperature range of -40°C to 100°C for extended-environment applications.
- Compliance RoHS compliant for reduced-hazard environmental requirements.
Typical Applications
- Industrial Automation Industrial-grade rating and -40°C to 100°C operation make the device suitable where extended-temperature reliability and many I/Os are needed for sensors and actuators.
- Embedded Systems High logic count and approximately 5.12 Mbits of embedded memory allow integration of complex control and processing functions on a single FPGA.
- Communications and Networking Large I/O count supports multiple interfaces and signal routing for networking line cards or protocol processing modules.
Unique Advantages
- High Logic Density: 146,124 logic elements enable implementation of large logic designs without needing multiple devices, reducing board-level complexity.
- Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduce reliance on external memory for buffering and real-time data handling.
- Broad I/O Count: 293 I/Os provide flexibility for connecting numerous peripherals, sensors, and external interfaces directly to the FPGA.
- Wide Voltage Compatibility: 1.14 V to 2.625 V operation supports integration with a variety of system power architectures.
- Robust Environmental Range: Industrial grade and -40°C to 100°C operation support deployment in harsh or varied-temperature environments.
- Compact BGA Packaging: 536-pin LFBGA and CSPBGA packages allow high-density PCB designs while maintaining surface-mount assembly.
Why Choose M2GL150-1FCS536I?
The M2GL150-1FCS536I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a combination of large logic resources, significant embedded memory, and abundant I/O. Its voltage flexibility and BGA packaging make it suitable for compact, high-density systems that must operate across extended temperature ranges.
This device is appropriate for engineering teams designing complex embedded systems, industrial control platforms, or communications modules that benefit from on-chip memory and extensive I/O while meeting RoHS and industrial-environment requirements.
Request a quote or submit an inquiry to receive pricing and availability information for the M2GL150-1FCS536I.

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