M2GL150-1FC1152I

IC FPGA 574 I/O 1152FCBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA

Quantity 609 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O574Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs146124Number of Logic Elements/Cells146124
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5120000

Overview of M2GL150-1FC1152I – IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA

The M2GL150-1FC1152I is an IGLOO2 FPGA from Microchip Technology designed for industrial embedded designs that require substantial programmable logic, on-chip memory and a high I/O count. As a field programmable gate array, it provides designers with reconfigurable logic resources for custom digital functions while supporting a broad operating voltage range and industrial temperature operation.

Key on-chip resources include 146,124 logic elements, approximately 5.12 Mbits of embedded memory and 574 user I/Os, all delivered in a 1152-FCBGA (35×35) surface-mount package. The device is RoHS compliant and specified for -40°C to 100°C operation.

Key Features

  • Logic Capacity  146,124 logic elements provide a large fabric for implementing complex custom logic and control functions.
  • Embedded Memory  Approximately 5.12 Mbits of on-chip RAM to support buffering, state machines and data storage close to logic.
  • I/O Density  574 user I/Os enable high pin-count interfaces and multiple parallel connections for peripherals and external devices.
  • Power and Voltage  Supports a wide supply range from 1.14 V to 2.625 V to accommodate different system power domains and IO standards.
  • Package and Mounting  Available in a 1152-FCBGA (35×35) package; surface-mount mounting for PCB integration in compact assemblies.
  • Temperature Range  Industrial-grade operation from -40°C to 100°C for deployment in demanding environments.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Industrial Control  Use the device's industrial temperature rating and high logic capacity to implement real-time control, sequencing and interface logic for automation equipment.
  • High-Density I/O Systems  574 I/Os allow aggregation and routing of multiple parallel interfaces in communication gateways, protocol converters and I/O concentrators.
  • Embedded Processing  Combine the large logic resource pool and on-chip memory to implement custom accelerators, glue logic and peripheral controllers in embedded platforms.

Unique Advantages

  • Substantial Logic Resources: 146,124 logic elements enable complex custom designs without immediately requiring larger external devices.
  • Significant On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
  • High I/O Count: 574 user I/Os simplify integration of multiple peripherals and parallel interfaces, lowering board-level complexity.
  • Flexible Power Integration: Wide supply range (1.14 V–2.625 V) supports integration into varied system power architectures.
  • Industrial Reliability: Specified for -40°C to 100°C operation to meet ambient conditions typical of industrial deployments.
  • Compact FCBGA Package: 1152-FCBGA (35×35) provides high pin density in a surface-mount form factor for space-constrained PCBs.

Why Choose M2GL150-1FC1152I?

The M2GL150-1FC1152I positions itself as a high-capacity IGLOO2 FPGA option for industrial embedded designs that need a balance of programmable logic, embedded memory and extensive I/O. Its combination of 146,124 logic elements, approximately 5.12 Mbits of on-chip RAM and 574 I/Os delivers the integration needed to consolidate functionality and reduce external components.

Backed by Microchip Technology and offered in a 1152-FCBGA surface-mount package with RoHS compliance, this device is suited to engineers targeting robust, scalable designs that must operate across a wide temperature range and varied supply conditions.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the M2GL150-1FC1152I.

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