M2GL150-1FCG1152I

The M2GL150-1FCG1152I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded applications. It integrates a high logic density and substantial on-chip memory with a large I/O count to support complex, I/O‑intensive designs.

With 146,124 logic elements and approximately 5.12 Mbits of embedded memory, this surface-mount 1152-FCBGA device targets designs that require programmable logic, broad interfacing, and operation across an industrial temperature range.

Key Features

• Logic Capacity  146,124 logic elements provide significant programmable logic resources for implementing custom digital functions and complex state machines.
• Embedded Memory  Approximately 5.12 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without external memory.
• I/O Density  574 user I/Os enable extensive peripheral interfacing and high-pin-count system integration for multi-channel and multi-protocol designs.
• Package & Mounting  1152-FCBGA (35×35) package in a surface-mount format provides a compact footprint for board-level integration.
• Power Supply Range  Supports supply voltages from 1.14 V to 2.625 V to accommodate a range of system power architectures.
• Operating Temperature  Rated for −40 °C to 100 °C operation, suitable for industrial environments requiring extended temperature tolerance.
• Regulatory Compliance  RoHS‑compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Implement real-time logic, sensor interfaces, and control functions where broad I/O and industrial temperature operation are required.
• Communications & Networking  Use the device’s logic and I/O resources to implement protocol handling, packet processing, and customized interface bridging.
• Embedded Signal Processing  Deploy on-chip memory and logic elements for deterministic data paths, buffering, and preprocessing in embedded systems.
• Custom Peripheral Integration  Integrate multiple external devices and sensors through the high I/O count for system consolidation and reduced BOM complexity.

Unique Advantages

• High Logic Density: 146,124 logic elements enable substantial logic integration for complex custom designs.
• Ample On‑Chip Memory: Approximately 5.12 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O Capacity: 574 I/Os support multi-channel interfaces and high levels of peripheral connectivity.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Flexible Power Range: Wide supply voltage support (1.14 V to 2.625 V) offers flexibility in system power architecture choices.
• Compact System Integration: 1152-FCBGA (35×35) surface-mount package allows high-density board-level implementation.

Why Choose M2GL150-1FCG1152I?

The M2GL150-1FCG1152I delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in an industrial-grade FPGA package from Microchip Technology. It is suited to designers who need programmable logic resources and robust interfacing in temperature-challenging environments.

Its specification set supports consolidation of system functions, reduced external component count, and flexible power and I/O configurations—making it a practical choice for embedded and industrial applications that require scalability and reliable long-term deployment.

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